WMSIC Electronic Components

YJYCOIN YSPI1040-2R2M YSPI1040

ModelYSPI1040-2R2M
PackageSMD,11.5x10mm
BrandYJYCOIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJYCOIN YSPI1040-2R2M
Type
YJYCOIN
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJYCOIN
Electronic Component
YSPI1040-2R2M
Electronic Component
1
Package
SMD,11.5x10mm
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
2.51g
Inductor
2.2uH
Electronic Component
1
Electronic Component
BM0266125428
Current
14A
Resistor(DCR)
6mΩ
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YSPI1040-2R2M一体成型功率电感产品概述

一、产品定位与核心价值

YSPI1040-2R2M是益嘉源(YJYCOIN)推出的贴片式一体成型功率电感,专为中大功率电子设备的电源系统设计,核心定位是在紧凑封装内实现高电流承载、低损耗与高可靠性的平衡。产品针对现代电子设备小型化、高效率的需求,解决了传统绕线电感在大电流下损耗高、尺寸大、可靠性不足的痛点,可广泛适配工业、通信、消费电子等多领域的电源场景。

二、关键参数详解

该电感的核心参数直接决定了其应用适配性,关键指标如下:

  • 电感值:2.2μH,精度±20%——满足常规电源滤波、储能的基础需求,精度范围覆盖多数工业级电源设计的容差要求;
  • 额定电流:14A——持续工作时允许通过的最大电流(不考虑额外散热时的温度上升限制),可支撑中大功率DC-DC转换器等场景的电流需求;
  • 直流电阻(DCR):6mΩ——极低的直流电阻是产品核心优势之一,大电流下的热损耗显著降低(损耗公式:P=I²×R),有效提升电源转换效率;
  • 封装尺寸:11.5mm×10mm×4mm(长×宽×高)——SMD贴片封装,尺寸紧凑,适配高密度PCB布局,符合设备小型化趋势。

三、封装与结构优势

YSPI1040-2R2M采用一体成型结构与SMD贴片封装,带来多重性能优势:

  1. 可靠性提升:一体成型工艺将磁芯与线圈紧密结合,无传统绕线电感的磁芯缝隙,抗振动、抗冲击能力更强,适合工业控制、车载等对环境可靠性要求高的场景;
  2. EMI抑制:封闭的磁芯结构减少了电磁干扰的向外辐射,同时降低了外部干扰对电感的影响,有助于简化系统EMI设计;
  3. 生产效率:贴片封装支持自动化贴装,可直接集成到SMT生产线,降低人工成本,提升批量生产效率;
  4. 空间利用率:11.5×10×4mm的小尺寸,可在有限的PCB空间内布局多个电感,满足多通道电源设计需求。

四、典型应用场景

结合产品参数与结构优势,YSPI1040-2R2M适用于以下场景:

  • 通信设备电源:服务器、基站的DC-DC转换器(如12V转5V/3.3V的大电流模块);
  • 工业控制电源:PLC、变频器、伺服驱动器的辅助电源,需高可靠性与大电流承载;
  • 消费电子:笔记本电脑、游戏本的电源适配器/内置电源模块,兼顾小尺寸与高效率;
  • LED驱动电源:大功率LED照明(如工矿灯、户外显示屏)的恒流驱动模块,低损耗降低发热;
  • 汽车电子:车载充电器(OBC)、中控系统电源、ADAS辅助电源,适配车载振动环境。

五、性能亮点总结

YSPI1040-2R2M的核心竞争力体现在:

  • 高电流与低损耗兼顾:14A额定电流搭配6mΩ低DCR,在大电流场景下热损耗小,效率高;
  • 紧凑封装适配小型化:11.5×10×4mm尺寸,满足设备轻薄化需求;
  • 一体成型提升可靠性:抗振动、抗冲击,EMI性能优异;
  • 宽场景适配:覆盖工业、通信、消费电子、汽车等多领域电源系统。

该产品通过参数优化与结构设计,平衡了性能与成本,是中大功率电源系统中电感选型的高性价比方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.