Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TXM16M0004252BBCEO00T是雅晶鑫(YJX)品牌推出的一款小型化无源石英晶振,采用SMD2520-4P封装,核心参数覆盖通用16MHz频率及工业级温宽,适用于多数嵌入式系统、工业控制及消费电子场景。
该型号为无源晶振(无内置振荡电路,需外接匹配电路才能工作),品牌为雅晶鑫(YJX),封装类型为SMD2520-4P(尺寸约2.5mm×2.0mm×0.8mm,4引脚贴片封装),型号后缀明确16MHz标称频率及参数配置,支持自动化表面贴装(SMT),可有效节省PCB布局空间。
SMD2520-4P为小型化贴片设计,支持SMT自动化贴装,适用于对PCB空间要求严格的产品(如智能穿戴、小型传感器模块),引脚布局紧凑,抗机械振动性能较好。
结合参数特性,该晶振适用于:
该晶振工作温度范围为**-40℃+85℃**,覆盖工业级温宽,可适应低温(户外设备、北方冬季)及高温(密闭机箱散热环境)场景;存储温度默认符合无源晶振常规标准(-55℃+125℃),相对湿度可承受5%~95%(非冷凝),满足多数应用环境要求。
需在晶振两端并联匹配电容,确保等效负载电容接近8pF。例如:若引脚寄生电容为2pF,则外围电容可选用两个12pF(并联后6pF,加寄生电容共8pF),或一个10pF+一个15pF(并联后6pF),具体需根据实际寄生电容调整。
回流焊需遵循常规SMT曲线(峰值温度≤260℃,回流时间≤10s);手工焊接烙铁温度≤350℃,焊接时间≤3s,避免过热损坏晶振。
该型号凭借小型化封装、宽温稳定性及通用频率,可作为多数中低端电子设备的可靠时钟源,满足量产及成本控制需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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