WMSIC Electronic Components

YJX TX201632M4BBCE2T

ModelTX201632M4BBCE2T
PackageSMD2016-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TX201632M4BBCE2T
Type
SMD2016-4P
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TX201632M4BBCE2T
Electronic Component
1
Package
SMD2016-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.034g
Frequency
32MHz
Electronic Component
1
Electronic Component
BM0264209307
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
8pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TX201632M4BBCE2T 产品概述

一、产品简介

TX201632M4BBCE2T 是雅晶鑫(YJX)推出的全国产贴片晶振,尺寸超小超薄,采用 SMD2016-4P 封装,工作频率 32.000 MHz,面向对体积和频率精度有较高要求的便携与嵌入式设备。产品在常温下初始频差为 ±10 ppm,温度稳定度可达 ±30 ppm,适用温度范围 -40℃ 至 +85℃。

二、主要特性与优势

  • 高频率:32 MHz,适配多种微控制器和通信芯片的时钟需求。
  • 高精度:常温频差 ±10 ppm,保证系统同步与定时精度。
  • 良好温漂:频率稳定度 ±30 ppm(全温区),适应工业级温度变化。
  • 低等效串联电阻(ESR):40 Ω,有利于振荡器回路启动与稳定。
  • 负载电容:标称 8 pF,便于与常见 MCU/振荡器 IC 匹配。
  • 超小封装:SMD2016-4P(2.0×1.6 mm),便于高密度 PCB 布局与轻薄产品设计。

三、典型应用场景

  • 可穿戴设备与智能手表
  • 无线通信模块与蓝牙/LoRa 芯片组
  • IoT 终端与传感节点
  • 工业控制和计量类设备要求稳定时钟的场合

四、主要技术参数

  • 晶振类型:贴片晶振(SMD)
  • 频率:32.000 MHz
  • 常温频差:±10 ppm
  • 频率稳定度(全温区):±30 ppm
  • 负载电容:8 pF
  • 等效串联电阻(ESR):40 Ω
  • 工作温度:-40℃ ~ +85℃
  • 品牌:YJX(雅晶鑫)
  • 封装:SMD2016-4P

五、封装与安装建议

SMD2016-4P 为行业常用超小型贴片封装,建议按制造商提供的 PCB 焊盘布局进行开窗与焊盘设计,以保证焊接强度与回流兼容性。推荐在实际产品中对回流焊工艺进行验证,确认焊接温度曲线不会影响频率特性与可靠性。

六、使用建议与注意事项

  • 负载电容匹配:晶体标称 CL=8 pF,考虑 PCB 寄生电容(2–5 pF),若使用对称电容 C1=C2,可按 CL = C/2 + Cstray 估算所需电容。
  • 驱动电平:避免过驱动,参考所用振荡器/MCU 的驱动能力与晶体厂商建议,防止频率漂移与老化。
  • 布线:振荡器引脚附近保持净空、接地良好,减少噪声耦合以保证启动与稳定性。
  • 储存与搬运:避免受潮与强应力碰撞,贴片晶体应按标准贴片元件保管与回流焊前干燥处理(如适用)。

七、质量与可靠性

雅晶鑫提供批次检测与出货测试,常规包含频率、ESR、老化与温度循环等项目。为保证长期稳定性,建议在量产前与供应商确认可靠性测试报告(如温度循环、机械振动与湿热测试)并进行客户侧验证。

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