WMSIC Electronic Components

YJX TAXM24M4RCBDDT2T

ModelTAXM24M4RCBDDT2T
PackageSMD3225-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TAXM24M4RCBDDT2T
Type
YJX
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TAXM24M4RCBDDT2T
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.04g
Frequency
24MHz
Electronic Component
1
Electronic Component
BM0264594696
Operating Temperature
30℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
9pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TAXM24M4RCBDDT2T 无源贴片晶振产品概述

一、产品基本信息

TAXM24M4RCBDDT2T是雅晶鑫(YJX) 推出的一款无源贴片晶振,采用SMD3225-4P封装(尺寸3.2×2.5mm),专为小型化、高可靠性电子设备设计。作为无源晶振,其无需外部供电,仅需配合振荡电路即可产生稳定的24MHz基准频率,广泛适配消费电子、工业控制、通信等多领域应用。

二、核心参数详解

该型号晶振的关键性能参数直接决定了应用场景的适配性,核心参数如下:

  • 标称频率:24MHz(固定基准频率,满足多数中低速数字电路的时钟需求);
  • 常温频差:±10ppm(25℃环境下,频率偏差控制在0.00024MHz以内,精度满足通用电子设备要求);
  • 负载电容:9pF(必须匹配9pF的外接电容,否则会导致实际振荡频率偏离标称值);
  • 频率稳定度:±20ppm(-30℃~+85℃工作温度范围内,频率偏差不超过0.00048MHz,覆盖工业级温度需求);
  • 等效串联电阻(ESR):30Ω(低ESR设计,可提高振荡电路启动速度,减少功耗损耗,增强电路稳定性);
  • 工作温度范围:-30℃+85℃(支持工业环境及部分车载低温场景,高于普通商用级晶振的0℃70℃范围);
  • 封装形式:SMD3225-4P(贴片式4引脚封装,适配回流焊工艺,适合高密度PCB布局)。

三、性能特点优势

  1. 宽温稳定可靠:-30℃~+85℃的工作温度范围,搭配±20ppm的频率稳定度,可在工业现场、低温户外等复杂环境下稳定工作,避免因温度变化导致的频率漂移;
  2. 低功耗高效能:30Ω的低ESR设计,减少振荡电路功率损耗,同时加快晶振启动响应速度(通常小于10ms),适合电池供电的便携式设备;
  3. 小型化适配性:SMD3225封装体积仅3.2×2.5mm,相比传统DIP封装节省约70%的PCB空间,可满足智能穿戴、小型传感器等设备的紧凑布局需求;
  4. 无源高可靠性:无内置有源元件(如振荡管),结构简单,抗干扰能力强,长期使用故障率低,寿命可达10万小时以上。

四、典型应用场景

TAXM24M4RCBDDT2T的参数特性使其适配多类电子设备,典型应用包括:

  • 消费电子:智能手表、蓝牙耳机、便携式蓝牙音箱、MP3播放器(满足小型化+低功耗需求);
  • 工业控制:PLC模块、传感器节点、小型工控主板(宽温范围适配工业现场);
  • 通信设备:蓝牙4.0/5.0模块、WiFi子模块、低速率无线网关(24MHz频率适配多数无线芯片的时钟输入);
  • 物联网终端:智能家居传感器(温湿度/门窗传感器)、智能门锁(小型化+稳定频率需求);
  • 车载辅助电路:车载音响系统、仪表盘背光控制模块(-30℃低温适配北方冬季环境)。

五、应用注意事项

  1. 负载电容匹配:需确保外接电容的串联总容量为9pF(通常选择两个18pF电容串联,或一个9pF电容+适当补偿),否则频率偏差会超出规格;
  2. 振荡电路设计:需配合反相器(如74HC04)或专用振荡芯片,确保电路增益≥33mS(对应30Ω ESR的启动要求);
  3. 焊接与存储:回流焊峰值温度需控制在245℃±5℃(时间≤10s),存储环境温度≤30℃、湿度≤60%,避免静电损伤;
  4. 精度适配:若需更高精度(如±5ppm以下),需选择温补晶振(TCXO)或压控晶振(VCXO),本型号仅满足通用精度需求。

该产品凭借稳定的性能、小型化封装及宽温适应性,成为通用电子设备中24MHz时钟源的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.