WMSIC Electronic Components

YJX YC25MDBCD2XT

ModelYC25MDBCD2XT
PackageSMD3225-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX YC25MDBCD2XT
Type
YJX
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
YC25MDBCD2XT
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.036g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0264981821
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
10pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YC25MDBCD2XT 产品概述

一、产品简介

YC25MDBCD2XT 为雅晶鑫(YJX)全国产贴片晶振,标准频率为 25.000 MHz,封装为 SMD3225-4P(3.2×2.5mm,四脚结构)。本产品针对工业级与消费级电子设备的时钟源需求设计,体积小、性能稳定,便于 SMT 工艺大批量贴装。

二、主要技术参数

  • 晶振类型:贴片晶振(SMD)
  • 频率:25.000 MHz
  • 常温频差(初始容差):±10 ppm
  • 负载电容:10 pF
  • 频率稳定度(含温度漂移等):±20 ppm
  • 工作温度:-40 ℃ ~ +85 ℃
  • 品牌:YJX(雅晶鑫)
  • 封装:SMD3225-4P

三、产品特点

  • 全国产制造,供应链可控,适合国产化替换与本地化量产需求。
  • 小体积、低剖面,适配高密度 PCB 布局。
  • 常温初始精度优良(±10 ppm),在典型工业温区内保持 ±20 ppm 稳定度,满足大多数通信、微控制器及数字电路时钟要求。
  • 4 针脚封装便于焊接与接地处理,利于抑制干扰与提高频率稳定性。

四、应用场景

适用于微控制器外置时钟、通信模块(含射频模块基准)、网络设备、工业控制、消费电子以及各种需要 25 MHz 基准时钟的系统。

五、封装与布局建议

  • 建议参考 SMD3225-4P 的标准 PCB 封装 footprints,焊盘尺寸与焊膏量按厂家推荐执行。
  • 晶振与相关输入脚之间走线尽量短且等长,避免与高速信号、开关电源等强干扰源并行。
  • 外围接地面应良好,尽量在晶振下方保留连地铜箔以提高屏蔽与热稳定性。

六、使用与匹配建议

  • 负载电容匹配公式:CL = (C1·C2)/(C1 + C2) + Cstray。为满足器件标称 10 pF,常见做法是选择两只相等的电容,按板上寄生电容(一般 1–3 pF)计算后确定电容值(例如寄生约 2 pF 时,单只电容约 16 pF)。
  • 建议采用高品质陶瓷电容(NP0/C0G)以减少温漂。
  • 回流焊工艺请遵循厂家提供的回流曲线与可焊性说明,避免超过推荐的热应力。

七、采购与质量保障

YC25MDBCD2XT 为雅晶鑫系列产品,适配批量生产采购。出厂前经过频率筛选与电气性能检测,符合常规可靠性要求。具体订购、样品、器件检验与回流工艺详情请联系供应商获取技术资料与检验报告。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.