WMSIC Electronic Components

YJX T322525MKBCD2X

ModelT322525MKBCD2X
PackageSMD3225-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX T322525MKBCD2X
Type
YJX
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
T322525MKBCD2X
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.04g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0264778350
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
18pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

T322525MKBCD2X 产品概述

一、产品简介

T322525MKBCD2X 为雅晶鑫(YJX)全国产贴片晶振,封装为 SMD3225-4P(3.2 × 2.5 mm),标称频率 25.000 MHz。该器件面向对频率精度和稳定性有中高要求的嵌入式和通信类应用,适用于微处理器、FPGA、时钟同步模块及一般系统时钟源等场景。

二、主要电气参数

  • 标称频率:25.000 MHz
  • 常温频差(初始公差):±10 ppm(室温)
  • 频率稳定度(含温度、老化等典型):±30 ppm
  • 负载电容:18 pF(CL)
  • 等效串联电阻(ESR):30 Ω(典型)
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、产品特性与优势

  • 小型 SMD3225 封装,适合高密度贴片组装与自动化生产;
  • 较小的 ESR(30 Ω)有利于稳定起振并兼容常见 MCU/振荡器输入;
  • 初始频差 ±10 ppm 与整体稳定度 ±30 ppm 能满足多数通信与控制系统的精度要求;
  • 宽工作温度支持工业级应用。

四、应用建议与设计注意事项

  • 晶振两端建议接地式负载电容(C1、C2)用于形成对称负载。按等效电容计算和布线寄生电容(通常 2–5 pF),推荐单侧电容值约 30–33 pF(等值时)。实际值应通过测量并结合目标系统寄生电容进行微调;
  • 布局时将晶振尽量靠近 MCU/振荡器引脚,连接线短且等长,减少走线上的干扰与寄生电容;避免将高速或大电流走线与晶体走线平行;
  • 保持地平面完整,为晶振提供良好参考地并减少 EMI 影响。

五、焊接、可靠性与存储

  • 建议按照厂家推荐的回流焊(Reflow)温度曲线进行焊接,避免过长高温暴露以降低性能漂移与内部应力;
  • 存储环境应干燥、防潮、防强烈震动;长期存储前建议参考出厂防潮包装与储存期限说明;
  • 在系统设计中需考虑 ESD、振动与冲击防护,关键应用建议进行环境应力测试与老化评估。

六、选型与校验建议

  • 若系统对频率精度或温度漂移有更高要求,可与供应商确认更严格等级或温度补偿/振荡器方案;
  • 在产品验证阶段,应对目标电路进行起振时间、稳频时间、相位噪声/抖动(如需)等实测,以确保达到系统时序需求;
  • 若存在特殊驱动要求(例如高驱动电平或特定负载网络),请参阅雅晶鑫技术资料或联系厂家获取详细应用手册。

T322525MKBCD2X 提供了在紧凑封装下兼顾精度与稳定性的解决方案,适合大多数工业级与消费类电子时钟应用。购买与批量使用前建议索取样品并完成在目标电路中的验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.