WMSIC Electronic Components

YJX TAXM26M4RLBCDT2T

ModelTAXM26M4RLBCDT2T
PackageSMD3225-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TAXM26M4RLBCDT2T
Type
YJX
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TAXM26M4RLBCDT2T
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.04g
Frequency
26MHz
Electronic Component
1
Electronic Component
BM0264209315
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TAXM26M4RLBCDT2T 贴片晶振产品概述

一、产品基本定位与核心身份

TAXM26M4RLBCDT2T是雅晶鑫(YJX) 推出的工业级高频贴片晶振,采用SMD3225-4P标准贴片封装,核心频率26MHz。作为雅晶鑫成熟产品线中的通用型时钟源器件,其兼顾了宽温稳定性、低功耗与小型化适配,专为需要可靠时钟信号的中高端电子设备设计,覆盖工业、通信、消费电子等多领域场景。

二、关键性能参数详解

该晶振的核心参数围绕“稳定、适配、高效”展开,具体如下:

1. 频率核心指标

  • 标称频率:26MHz(工业/通信领域通用标准频率,兼容性强,可直接替换同规格竞品);
  • 常温频差:±10ppm(25℃环境下,实际频率与标称值偏差≤260Hz,满足大多数精度要求);
  • 频率稳定度:±20ppm(全工作温度范围内,频率偏差≤520Hz,确保宽温环境下时钟不漂移);
  • 工作温度范围:-40℃~+85℃(覆盖工业级典型环境,可在低温存储、高温作业场景稳定工作)。

2. 电气与封装特性

  • 负载电容:20pF(需电路匹配该值以保证最佳振荡效果,避免频率偏移);
  • 等效串联电阻(ESR):30Ω(低ESR设计,降低振荡电路功耗,提升信号完整性);
  • 封装尺寸:SMD3225-4P(3.2×2.5mm贴片尺寸,4引脚设计,适配自动化贴装工艺,适合小型化设备)。

三、典型应用场景

TAXM26M4RLBCDT2T的参数特性使其适配多类场景,具体包括:

1. 工业控制设备

PLC(可编程逻辑控制器)、伺服驱动器、传感器模块等,宽温范围可满足车间、户外工业环境的温度波动需求。

2. 通信与网络设备

路由器、交换机、4G/5G基站射频前端、物联网网关等,26MHz频率是通信电路常用时钟源,适配数据传输的时序要求。

3. 消费电子与智能设备

智能手表、智能家居控制器、便携式医疗设备(如小型监护仪)等,小型封装适配设备 miniaturization 趋势。

4. 扩展应用(车载电子)

车载信息娱乐系统、胎压监测模块等(需确认具体车载认证,但宽温范围可覆盖部分车载场景)。

四、产品优势与市场价值

该晶振的核心竞争力体现在以下几点:

1. 宽温可靠性

-40℃~+85℃的工作温度范围,解决了普通商用晶振在低温/高温下频率漂移的问题,适合 harsh 环境(如北方户外设备、高温车间)。

2. 低功耗与信号稳定

30Ω低ESR减少振荡电路的能量损耗,同时降低信号噪声,提升时钟精度,延长设备续航(尤其适合便携式设备)。

3. 通用兼容性

26MHz标准频率+SMD3225封装,可直接替换同规格竞品,降低设计与采购成本,缩短产品研发周期。

4. 品牌保障

雅晶鑫作为国内晶振领域成熟厂商,产品经过振动、冲击、湿度等工业级可靠性测试,售后风险低。

五、选型与使用注意事项

为确保性能稳定,需注意以下细节:

1. 负载电容匹配

电路设计需确保负载电容接近20pF(可通过并联/串联电容调整),否则会导致频率偏移超出规格。

2. 温度范围确认

若应用场景温度超出-40~+85℃(如车载125℃),需选择更高温稳的晶振型号。

3. 振荡裕量检查

30Ω ESR属于低阻抗,需确认振荡电路的驱动能力(如反相器输出电流)是否匹配,避免停振。

4. 贴装工艺

SMD3225封装需采用符合IPC标准的贴装设备,避免引脚虚焊、偏移影响性能。

综上,TAXM26M4RLBCDT2T是一款高性价比工业级贴片晶振,适合对时钟稳定性、宽温适应性有要求的电子设备,可作为多数场景的“通用型时钟源首选”。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.