WMSIC Electronic Components

YJX TAXM30MRFBCCT2T

ModelTAXM30MRFBCCT2T
PackageSMD3225-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TAXM30MRFBCCT2T
Type
YJX
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TAXM30MRFBCCT2T
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.05g
Frequency
30MHz
Electronic Component
1
Electronic Component
BM0264498424
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Frequency
±15ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TAXM30MRFBCCT2T无源贴片晶振产品概述

TAXM30MRFBCCT2T是雅晶鑫(YJX)推出的一款工业级无源石英贴片晶振,采用SMD3225-4P小型化封装,针对宽温环境与精度需求优化设计,广泛适配消费电子、工业控制、通信等领域的量产场景。

一、产品身份与基本属性

该型号核心身份信息明确,属于无源晶振范畴:

  • 品牌:雅晶鑫(YJX)
  • 型号:TAXM30MRFBCCT2T
  • 封装:SMD3225-4P(3.2×2.5mm表面贴装,4引脚设计)
  • 类型:无源石英晶振(无需外部电源,依赖振荡电路起振)

二、核心性能参数详解

1. 频率与精度指标

  • 标称频率:30MHz(射频/中频常用段,适配多数通信、控制电路)
  • 常温频差:±10ppm(频率偏差≤300Hz,满足常规高精度需求)
  • 频率稳定度:±15ppm(涵盖温度变化、电源波动等因素的总稳定度,优于通用晶振)

2. 电气与温度特性

  • 负载电容:12pF(无源晶振频率由负载电容决定,需匹配该值保证精度)
  • 等效串联电阻(ESR):30Ω(低阻抗设计,提升起振可靠性,减少电路损耗)
  • 工作温度:-40℃至+85℃(工业级宽温,适应户外、高低温环境)

三、封装设计与物理特性

SMD3225-4P封装具备以下优势:

  • 尺寸紧凑:3.2mm(长)×2.5mm(宽)×0.8mm(典型高度),节省PCB空间,适配便携设备;
  • 4引脚布局:相比2引脚无源晶振,支持更稳定的振荡电路布局,抗干扰能力略有提升;
  • 贴装兼容性:兼容自动化贴片生产,焊接可靠性高,适合批量制造。

四、关键特性及应用优势

  1. 宽温稳定可靠:-40~85℃工作范围,满足工业控制、车载辅助系统等恶劣环境;
  2. 精度适配多场景:±10ppm常温频差+±15ppm稳定度,覆盖通信(WiFi模块)、工业传感器等精度要求;
  3. 起振性能优异:30Ω低ESR,易与反相器、XO电路匹配,减少起振失败概率;
  4. 小型化便携设计:SMD3225封装,适配智能手表、蓝牙耳机等小型化消费电子;
  5. 无源设计成本可控:无需外部电源,电路简单,故障率低,适合大规模量产。

五、典型应用场景

该晶振平衡了精度、温区与体积,适用于:

  • 工业控制:PLC模块、传感器节点、电机驱动器(宽温需求);
  • 消费电子:智能穿戴(手表/手环)、蓝牙耳机、便携式仪器(小型化需求);
  • 通信设备:小型基站、路由器、IoT无线模块(频率精度需求);
  • 车载电子:仪表盘、倒车雷达模块(中温区需求);
  • 智能家居:智能门锁、温湿度传感器(低功耗+小型化)。

六、选型与使用注意事项

  1. 负载电容匹配:必须使用等效12pF的负载电容(可并联实现),否则频率偏移超出规格;
  2. 振荡电路设计:选择驱动能力匹配的反相器(如74HC04),确保起振稳定;
  3. 焊接工艺:遵循SMD回流焊曲线(峰值230~250℃),避免过热损坏晶体;
  4. 静电防护:虽无源晶振抗静电优于有源,但需注意ESD防护(接地操作);
  5. 温区验证:若环境超出-4085℃,需更换扩展温区(如-55125℃)型号。

该晶振通过振动、冲击、湿度等可靠性测试,可满足多数商用及工业级设备的长期稳定运行需求。

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