WMSIC Electronic Components

YJX TAXM32M4RFBCCT2T

ModelTAXM32M4RFBCCT2T
PackageSMD3225-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TAXM32M4RFBCCT2T
Type
YJX
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TAXM32M4RFBCCT2T
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.05g
Frequency
32MHz
Electronic Component
1
Electronic Component
BM0264209310
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Frequency
±15ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TAXM32M4RFBCCT2T 无源贴片晶振产品概述

一、产品基本定位

TAXM32M4RFBCCT2T是雅晶鑫(YJX)推出的工业级无源贴片石英晶振,型号后缀明确核心参数(32M=32MHz频率、SMD3225-4P=封装规格)。作为通用时钟源器件,该晶振采用4引脚贴片封装,专为需要稳定频率参考、宽温适应性的电子设备设计,可覆盖消费电子、工业控制、通信终端等多领域的时钟同步需求。

二、核心参数详解

该晶振的关键性能参数直接决定应用适配性,具体解析如下:

  • 频率规格:标称频率32MHz,属于中高频常用频段,适配多数MCU(如STM32)、通信芯片(Wi-Fi/蓝牙)的时钟输入要求;
  • 常温频差:±10ppm,指25℃环境下实际频率与标称值的偏差范围,满足一般通信、工业设备的同步精度;
  • 负载电容:12pF,为晶振振荡必需的外部匹配电容(电路需并联对应容值陶瓷电容),是振荡稳定性的核心参数;
  • 频率稳定度:±15ppm,涵盖-40℃~+85℃全温区的频率变化量,体现宽温下的频率一致性,符合工业级要求;
  • 等效串联电阻(ESR):30Ω,值越低则振荡幅度越稳定、功耗越低,30Ω属于无源晶振的优良水平,可避免振荡失效;
  • 工作温度:-40℃~+85℃,覆盖工业环境极端温度(户外、高温车间等),保证全温区性能可靠。

三、封装与应用基础

该晶振采用SMD3225-4P封装,尺寸为3.2mm×2.5mm×0.8mm(典型厚度),4引脚贴片式设计,适配自动化SMT贴装工艺,大幅提升生产效率。引脚布局符合行业标准,电路设计无需特殊布线,仅需在两端并联12pF匹配电容即可与振荡电路配合工作。

四、产品性能优势

对比同类无源晶振,TAXM32M4RFBCCT2T具备以下核心优势:

  1. 宽温适应性:-40℃~+85℃工作范围,可稳定运行于极端环境,无需额外温度补偿;
  2. 稳定可靠性:低ESR(30Ω)+ 高频率稳定度(±15ppm),保证时钟无明显漂移,适配同步要求较高的设备;
  3. 成本与空间平衡:无源晶振无内置振荡电路,成本低于有源晶振;小封装节省PCB空间,适合紧凑型设备;
  4. 兼容性强:32MHz是多数MCU、通信模块的常用时钟频率,适配性广。

五、典型适用领域

该晶振可广泛应用于以下场景:

  • 工业自动化:PLC、传感器模块、工业机器人的时钟参考,满足宽温、抗干扰需求;
  • 通信终端:4G/5G小基站、无线路由器、智能网关的频率同步,保证数据传输稳定;
  • 消费电子:智能手表、机顶盒、智能家居温控器的时钟信号,兼顾成本与性能;
  • 车载电子:车载中控、胎压监测系统的辅助时钟(宽温适配部分车载场景,车规需额外认证)。

六、选型与使用注意事项

为保证晶振正常工作,需注意以下要点:

  1. 负载电容匹配:电路需并联12pF±5%陶瓷电容,避免容值偏差导致频率偏移;
  2. 振荡电路适配:无源晶振需外接MCU内置/外置振荡电路(反相器+反馈电阻),确认驱动能力匹配;
  3. 温度范围确认:若场景温度超出-40℃~+85℃,需选择更宽温型号;
  4. ESR验证:批量使用前通过示波器测试振荡幅度,幅度不足需检查ESR或匹配电容。

该晶振以高性价比、宽温稳定的特点,成为中端电子设备时钟源的优选方案,可满足多数工业与消费场景的时钟同步需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.