WMSIC Electronic Components

YJX TXM20.000M0002491LFBEO00T

ModelTXM20.000M0002491LFBEO00T
PackageHC-49S-SMD
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TXM20.000M0002491LFBEO00T
Type
YJX
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TXM20.000M0002491LFBEO00T
Electronic Component
1
Package
HC-49S-SMD
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.8g
Frequency
20MHz
Electronic Component
1
Electronic Component
BM0265401134
Operating Temperature
20℃~+70℃
Electronic Component
±30ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TXM20.000M0002491LFBEO00T 无源贴片晶振产品概述

TXM20.000M0002491LFBEO00T是雅晶鑫(YJX)推出的一款通用型无源贴片晶振,采用HC-49S-SMD封装,以20MHz为核心谐振频率,适配多数电子系统的时钟基准、信号同步需求,兼具成本效益与实用性能。

一、产品基本属性

该型号属于无源晶体(需外接振荡电路起振,无内置放大模块),品牌为雅晶鑫(YJX),封装形式为HC-49S-SMD(贴片式HC-49S)——是传统直插HC-49S的贴片化升级,完全适配现代SMT自动化生产流程。产品定位为中低精度通用晶振,覆盖消费电子、工业控制等主流场景。

二、核心电气参数详解

1. 频率与精度指标

  • 谐振频率:20MHz:晶体固有谐振频率,直接作为微控制器(MCU)、无线模块等的时钟基准,可避免额外分频/倍频损耗;
  • 常温频差±30ppm:25℃常温下,实际频率与标称值的偏差范围。换算为绝对偏差:20MHz×30×10⁻⁶=±600Hz,满足蓝牙模块、小型家电等对时钟精度的基本要求;
  • 频率稳定度±30ppm:工作温度范围内(-20℃~+70℃),频率相对于常温的最大变化量。结合常温频差,总频率变化范围为±60ppm(±1200Hz),可保证室内常温、部分工业车间等宽温场景的稳定性。

2. 负载与电阻特性

  • 负载电容:20pF:振荡电路需外接的总负载电容(通常为两个10pF电容并联),需严格匹配以避免频率偏移——若负载电容偏差±10%,可能导致实际频率偏离标称值;
  • 等效串联电阻(ESR):40Ω:晶体串联谐振点的等效电阻,直接影响起振难度与功耗。40Ω属于该封装下的典型低阻值,可降低振荡电路设计复杂度,保证稳定起振(无需额外温补/增益补偿)。

3. 工作环境范围

  • 工作温度:-20℃~+70℃:覆盖一般室内环境(0℃~40℃)及部分工业常温场景(如车间、仓储),不适合极端低温(-40℃以下)或高温(85℃以上)场景。

三、封装与物理特性

HC-49S-SMD为2脚贴片封装,物理尺寸参考标准规格(长×宽×高≈11.5mm×4.5mm×3.5mm),采用陶瓷+塑料混合封装,具备以下特点:

  • 抗机械振动:封装结构可承受常规运输/使用中的轻微振动;
  • 电磁兼容:陶瓷基底降低电磁干扰,适合近场通信模块等场景;
  • 替换兼容性:引脚布局与直插HC-49S完全兼容,可直接替换现有直插方案,无需修改PCB设计。

四、典型应用场景

结合参数特性,该晶振适用于以下主流场景:

  1. 消费类电子:智能手表、蓝牙耳机、小型家电(加湿器、智能插座)的时钟基准;
  2. 工业控制:PLC辅助模块、温湿度传感器节点的信号同步;
  3. 通信设备:ZigBee、2.4G蓝牙等低速率无线模块的本地振荡源;
  4. 计算机外设:机械键盘、无线鼠标的通信时钟;
  5. 车载电子:车内非极端温区的辅助控制系统(如中控面板背光同步)。

五、性能优势总结

  1. 成本与精度平衡:±30ppm的精度满足多数通用需求,无源设计相比有源振荡器成本降低30%以上;
  2. 易起振与稳定性:40Ω低ESR保证电路快速起振,宽温范围适配多场景;
  3. 生产适配性:贴片封装支持SMT自动化生产,提高效率、降低人工成本;
  4. 替换兼容性:与直插HC-49S引脚兼容,便于现有产品升级。

该型号是通用电子系统中时钟基准的高性价比选择,适合对精度要求不极端、需批量生产的应用场景。

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