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YJX TXM4.9152M0002491LFBEO00T
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YJX TXM4.9152M0002491LFBEO00T
- Type
- YJX
- Minimum package
- 1000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YJX
- Electronic Component
- TXM4.9152M0002491LFBEO00T
- Electronic Component
- 1
- Package
- HC-49S-SMD
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.967g
- Frequency
- 4.9152MHz
- Electronic Component
- 1
- Electronic Component
- BM0264209306
- Operating Temperature
- 20℃~+70℃
- Electronic Component
- ±30ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 20pF
- Frequency
- ±30ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TXM4.9152M0002491LFBEO00T 产品概述
一、概述
TXM4.9152M0002491LFBEO00T 是雅晶鑫（YJX）推出的一款高可靠性的贴片晶振（HC-49S-SMD 封装），额定频率为 4.9152MHz。该产品针对嵌入式时钟、通信和消费类电子设备设计，提供良好的频率稳定性与可焊接的 SMD 机械结构，适用于自动化贴装与回流焊工艺。
二、主要性能特点
- 精确频率：标称 4.9152MHz，适用于需要精确分频或通信定时的系统。
- 负载电容：20pF，便于与常见 MCU/振荡电路匹配。
- 频率稳定度：±30ppm（常温频差 ±30ppm），在常温范围内保持较高的频率精度。
- 等效串联电阻（ESR）：80Ω，适配常见晶体振荡器驱动条件。
- 工作温度范围：-20℃ ~ +70℃，覆盖大多数室内和一般工业环境的应用场景。
- 封装形式：HC-49S-SMD，兼顾传统 HC-49S 的机械强度与贴片组装便利性。
三、典型应用场景
- 单片机（MCU）系统的主时钟或外部定时源。
- 消费电子与便携设备中的定时与通信模块。
- 工业控制与数据采集设备（在工作温度范围内）。
- 需要精确频率分频或串口波特率基准的方案。
四、使用与布局建议
- 负载电容匹配：为保证实际工作频率与标称一致，建议在晶振两端分别并接匹配电容，合成值考虑 PCB 寄生电容（通常约 2~5pF）。目标是使外端并联电容与标称 20pF 相匹配。
- 布局要求：晶体附近应尽量缩短走线，避免噪声源（高速信号线、开关电源）近距离干扰，并保持良好接地以降低 EMI。
- 焊接工艺：支持回流焊，建议按厂商推荐的回流温度曲线进行焊接，避免过高温度与快速冷却导致机械应力。
- 防静电与防振：在搬运和贴装过程中注意防静电保护和避免机械冲击，HC-49S-SMD 虽机械强度较好，但长期过度振动会影响可靠性。
五、可靠性与质量控制
雅晶鑫（YJX）对元器件进行严格的出厂检测与老化筛选，产品在出厂前通常经过频率检测、外观检验及基本电性测试，以保障频率稳定性和焊接一致性。用户在关键应用中可按需求进行额外的温度循环与老化测试以验证系统级稳定性。
六、订购与规格确认
- 品牌：YJX（雅晶鑫）
- 型号：TXM4.9152M0002491LFBEO00T
- 频率：4.9152MHz
- 负载电容：20pF
- 常温频差 / 频率稳定度：±30ppm
- ESR：80Ω
- 工作温度：-20℃ ~ +70℃
- 封装：HC-49S-SMD（贴片晶振）
如需量产规格书、封装尺寸图或回流焊工艺建议，请在订购前向供应商索取详细技术资料以便与您的电路设计和可靠性要求对齐。
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