WMSIC Electronic Components

YJX T49S8M2LDBE8S

ModelT49S8M2LDBE8S
PackageHC-49S
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX T49S8M2LDBE8S
Type
YJX
Minimum package
200 袋装

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
T49S8M2LDBE8S
Electronic Component
1
Package
HC-49S
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.52g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0264209303
Operating Temperature
20℃~+70℃
Electronic Component
±20ppm
Crystal Oscillator Type
Through-hole Crystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

T49S8M2LDBE8S直插晶振产品概述

这款T49S8M2LDBE8S是雅晶鑫(YJX)推出的通用型HC-49S封装直插石英晶振,以8MHz核心频率为基础,兼顾成本与基础稳定性,适合多数常规电子设备的时钟信号需求。以下从核心属性、性能参数、封装设计、应用场景及选型注意事项展开说明:

一、产品核心定位与基本属性

T49S8M2LDBE8S属于商业级通用晶振,定位为中低端电子设备的低成本时钟源,而非高精度计时场景。其核心属性明确:

  • 品牌:雅晶鑫(YJX),国内主流晶振厂商,产品以性价比和稳定性著称;
  • 封装:HC-49S直插式,引脚间距2.54mm,兼容常规DIP焊接工艺;
  • 类型:石英晶振,利用石英晶体的压电效应产生稳定振荡,老化率低;
  • 基础频率:8MHz,属于MCU、单片机等控制电路的常用时钟频率。

二、关键性能参数详解

产品参数围绕“常规稳定”设计,各参数的实际意义需明确:

  1. 常温频差±20ppm:常温(25℃左右)下,实际频率与标称8MHz的偏差不超过±160Hz(计算:8e6×20e-6=160),满足多数控制电路的频率精度要求;
  2. 负载电容20pF:需与振荡电路的负载电容严格匹配(若电路设计为20pF),否则会导致频率偏移——比如负载电容偏大,实际频率会略低于标称值;
  3. 频率稳定度±30ppm:指工作温度在-20℃~+70℃范围内时,频率相对于常温的偏差不超过±240Hz(8e6×30e-6=240),总偏差(频差+稳定度)为±50ppm(±400Hz),适合常规室内/车内环境;
  4. 等效串联电阻(ESR)80Ω:属于HC-49S封装的常规水平,ESR越小振荡越稳定,但80Ω已能满足普通振荡电路的驱动需求,无需额外增强驱动;
  5. 工作温度范围:-20℃~+70℃,覆盖商业级温度区间,不支持极端低温(如-40℃以下)或高温(如+85℃以上)环境。

三、封装与可靠性设计

HC-49S封装是晶振领域的经典直插封装,T49S8M2LDBE8S在封装设计上兼顾实用性与可靠性:

  • 封装结构:金属外壳+陶瓷基座,屏蔽性较好,能减少外界电磁干扰对振荡的影响;
  • 焊接兼容性:直插引脚(2脚)适配手工焊接、波峰焊,焊接温度建议不超过260℃(单次焊接时间≤3秒),避免高温损坏晶体;
  • 抗应力设计:引脚与基座的连接经过优化,能承受常规振动(如10~2000Hz,加速度≤10g)和冲击(如峰值加速度≤50g),适合批量生产中的运输与安装;
  • 长期稳定性:石英晶体的老化率通常在±5ppm/年以内,T49S8M2LDBE8S可满足设备3~5年的长期稳定工作需求。

四、典型应用场景

结合参数与定位,T49S8M2LDBE8S的典型应用集中在常规消费电子、小型工业控制、办公设备等领域:

  1. 消费电子:小型家电(微波炉、豆浆机的控制板)、遥控玩具(发射/接收模块)、智能音箱的辅助时钟;
  2. 小型工业控制:小型PLC(可编程逻辑控制器)、传感器模块(如温湿度传感器的MCU时钟)、小型电机驱动板;
  3. 办公设备:打印机、传真机的控制电路、桌面路由器的辅助时钟;
  4. 车载辅助设备:车载充电器、行车记录仪的MCU时钟(适配车内-20℃~+70℃的常规温度)。

这些场景对频率精度要求不苛刻,但需要低成本、稳定的时钟源,T49S8M2LDBE8S恰好匹配。

五、选型适配注意事项

为避免使用问题,选型时需注意以下3点:

  1. 负载电容匹配:必须确认电路设计的负载电容为20pF,若电路实际负载电容为12pF或30pF,需更换对应参数的晶振,否则会导致MCU时钟偏移,影响程序运行;
  2. 温度范围适配:若设备工作在极端环境(如户外低温、工业高温),需选择工业级晶振(-40℃~+85℃),T49S8M2LDBE8S不适用;
  3. 焊接与安装:焊接时避免引脚过度弯曲(弯曲半径≥2mm),安装时远离强电磁干扰源(如大功率电源),否则可能影响振荡稳定性。

总结来说,T49S8M2LDBE8S是一款高性价比的通用直插晶振,适合对成本敏感、温度范围要求不苛刻的常规电子设备,是多数中小批量产品的优选时钟源。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.