WMSIC Electronic Components

YJX TAXD11.0592M2GLDBET8S

ModelTAXD11.0592M2GLDBET8S
PackageHC-49S
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TAXD11.0592M2GLDBET8S
Type
YJX
Minimum package
200 袋装

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TAXD11.0592M2GLDBET8S
Electronic Component
1
Package
HC-49S
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.53g
Frequency
11.0592MHz
Electronic Component
1
Electronic Component
BM0264778327
Operating Temperature
20℃~+70℃
Electronic Component
±20ppm
Crystal Oscillator Type
Through-hole Crystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TAXD11.0592M2GLDBET8S无源晶振产品概述

TAXD11.0592M2GLDBET8S是雅晶鑫(YJX)推出的一款直插式无源石英晶体谐振器,采用HC-49S金属封装,针对11.0592MHz核心频率的精准时钟需求设计,广泛适配51系列单片机、低速通信模块等中低端嵌入式系统,是性价比突出的常规晶振选型。

一、产品基本信息梳理

该晶振的核心身份标签清晰:

  • 品牌型号:YJX雅晶鑫 TAXD11.0592M2GLDBET8S
  • 类型:无源石英晶体谐振器(需外接振荡电路及负载电容)
  • 封装:HC-49S直插金属封装(尺寸约11.5×4.5×3.5mm,通孔焊接)
  • 核心频率:11.0592MHz(串口通信精准波特率的常用衍生频率)

作为工业级常规款,其设计定位是满足大多数民用、轻度工业场景下的稳定时钟输出需求。

二、核心参数深度解析

各参数直接决定晶振的性能表现,需结合应用场景理解:

  1. 频率精度:常温频差±20ppm,工作温度范围频差±30ppm
    ppm为百万分之一,11.0592MHz的常温偏差约±0.22kHz,可保证串口通信(如9600bps)的波特率误差在可接受范围(通常要求≤0.5%)。
  2. 负载电容:20pF
    无源晶振需外接两个电容(引脚到地),总负载电容为两电容串联值+寄生电容,必须匹配20pF以避免频率偏移(建议选NP0/C0G材质电容,温度稳定性好)。
  3. 等效串联电阻(ESR):80Ω
    ESR越小起振越容易,80Ω属于常规水平,满足单片机内部振荡器的起振要求,无需额外驱动电路。
  4. 工作温度:-20℃~+70℃
    覆盖室内常温、户外轻度温变(如仓库、车间)场景,不适合极寒(-40℃以下)或高温(85℃以上)环境。

三、封装与应用类型优势

HC-49S直插金属封装是该晶振的核心设计亮点:

  • 抗干扰性:金属外壳屏蔽电磁干扰,适合靠近电源、高频电路的布局;
  • 安装便捷:通孔焊接无需特殊工具,批量生产效率高;
  • 成本可控:相比贴片封装或有源晶振,直插无源款的物料成本更低。

需注意:无源晶振依赖外部振荡电路(如单片机XTAL1/XTAL2引脚+外接电容),而有源晶振内置振荡电路,无需外接电容——该款为无源,选型时需确认电路设计是否匹配。

四、典型适用场景

11.0592MHz的频率特性决定了其核心应用方向:

  • 51系列单片机系统:11.0592MHz除以12(51单片机机器周期系数)得到921.6kHz,除以24得到460.8kHz,可精准生成9600bps、19200bps等标准串口波特率;
  • 低速通信模块:如UART、SPI接口的小型传感器节点、蓝牙低功耗(BLE)从机;
  • 小家电与电子玩具:成本敏感场景下的时钟源,如智能台灯、遥控玩具的控制电路;
  • 工业轻度控制:如小型电机调速、温湿度监测模块的定时逻辑。

五、使用注意事项

选型或焊接时需避开常见误区:

  1. 负载电容匹配:禁止用普通陶瓷电容(如X7R材质,温度系数大),必须选NP0/C0G电容,且每个引脚外接电容值建议为22pF(因PCB寄生电容约2pF,串联后接近20pF);
  2. 焊接温度控制:HC-49S封装的焊接温度不超过260℃,单个引脚焊接时间≤3秒,避免高温损坏晶振内部石英晶体;
  3. 布局抗干扰:晶振应紧贴单片机XTAL1/XTAL2引脚,走线长度≤1cm,远离电源纹波大的区域(如电容、电感);
  4. 温度环境:若应用场景温度超过70℃(如烤箱附近),需更换宽温晶振(如-40℃~+85℃)。

六、总结

TAXD11.0592M2GLDBET8S是一款“精准适配+高性价比”的无源晶振,其11.0592MHz频率精准匹配51单片机串口通信需求,HC-49S封装兼顾抗干扰与安装便捷性,适合中低端嵌入式系统的批量应用。若需更高精度(如±10ppm)或宽温范围,可考虑同品牌的升级款,但常规场景下该款已能满足稳定需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.