WMSIC Electronic Components

YONGYUTAI 2SC4617

Model2SC4617
PackageSOT-523
BrandYONGYUTAI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YONGYUTAI 2SC4617
Type
YONGYUTAI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YONGYUTAI
Electronic Component
2SC4617
Electronic Component
1
Package
SOT-523
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.025g
Electronic Component
1
Electronic Component
BM0228560701
Transistor Type
NPN
Frequency(f T)
180MHz
Power Dissipation(Pd)
150mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
150mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SC4617 产品概述

一、主要参数与性能

2SC4617 是一款YONGYUTAI(永裕泰)品牌的NPN小信号三极管,适用于低功耗和中等电流场合。关键参数如下:

  • 集电极电流 Ic:150 mA(最大)
  • 集-射极击穿电压 Vceo:50 V
  • 耗散功率 Pd:150 mW
  • 直流电流增益 hFE:560(在 Ic=1 mA、VCE=6 V 条件下)
  • 特征频率 fT:180 MHz
  • 集电极截止电流 Icbo:100 nA(典型,表现出较低漏电)
  • 集电极饱和电压 VCE(sat):约 400 mV(测试条件 IC=50 mA、IB=5 mA)
  • 射-基极击穿电压 Vebo:7 V
  • 封装:SOT-523(超小型表贴)

二、器件特点

  1. 高增益:在低电流工作点(1 mA)下 hFE 高达 560,适合用于微弱信号放大和高灵敏度前置放大器。
  2. 高频性能良好:fT≈180 MHz,支持 VHF 级别的小信号放大和高频开关应用。
  3. 低漏电流:Icbo 仅约 100 nA,有利于低功耗或高阻抗回路中保持稳定偏置。
  4. 小体积封装:SOT-523 适合空间受限的表贴设计,但散热能力受限,应注意功率管理。

三、典型应用场景

  • 小信号放大器(前置放大、音频前级低电流增益场合)
  • 高频振荡器、射频放大(低至中等功率)
  • 开关用途(逻辑电平驱动、驱动小负载)
  • 传感器前端(光电、霍尔、温度传感等需要高增益低漏电的场合)

四、使用建议与电路设计要点

  • 线性放大时建议工作电流远低于 Ic(max)=150 mA,以获得稳定 hFE 和散热裕度,典型偏置点可选 0.5–5 mA 区间。
  • 若用作开关,驱动基极电流应保证足够的过剩(例如 IB≈IC/10)以达到低饱和电压;参考 VCE(sat) 400 mV 在 IC=50 mA、IB=5 mA 的表现。
  • 由于 Pd=150 mW,SOT-523 封装散热能力有限,连续工作时要评估 PCB 铜箔面积与热阻,避免长期高耗散。
  • 高频应用需注意寄生电容和布局,缩短输入/输出走线、加适当去耦以维持增益与稳定性。

五、封装与热管理

SOT-523 为超小型表贴封装,适合高密度 PCB 布局;但封装限制了功耗散发,应通过增加铜箔面积、铺地平面或在散热关键区域加大铜厚来改善热阻。环境温度升高时需降低允许的集电极电流或采用间歇工作模式。

六、检验与选购建议

  • 选择时确认样片的 hFE、Icbo 等参数在应用工作点附近的典型值与分布;高 hFE 型器件对偏置电阻选择敏感,应做温漂测试。
  • 小型封装易受焊接应力影响,建议采用符合厂家回流曲线的焊接工艺并注意电静放电(ESD)防护。
  • 对于需要长期稳定工作的场合,建议做温度循环和老化测试以验证漏电和增益随温度的变化。

总结:2SC4617 以其高增益、较高 fT 和低漏电特点,适合低功耗高灵敏和中频高速的小信号放大与开关应用。设计时重点关注热管理与偏置稳定性,以确保长期可靠运行。

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