WMSIC Electronic Components

YONGYUTAI BC857C

ModelBC857C
PackageSOT-23
BrandYONGYUTAI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YONGYUTAI BC857C
Type
YONGYUTAI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YONGYUTAI
Electronic Component
BC857C
Electronic Component
1
Package
SOT-23
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0226441356
Transistor Type
PNP
Frequency(f T)
100MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
100mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC857C(永裕泰)产品概述

一、产品简介

BC857C 为小信号 PNP 晶体管,采用 SOT-23 封装,适用于低功耗贴片电路与小电流放大或开关场景。该器件在2 mA 工作点时具有很高的直流电流增益,配合较高的截止频率,能在音频及中高频信号处理场合提供良好性能。永裕泰(YONGYUTAI)品牌出品,适合批量贴片组装与成本敏感型设计。

二、主要性能指标

  • 晶体管类型:PNP
  • 集电极电流(Ic):100 mA(最大)
  • 集—射极击穿电压(Vceo):45 V
  • 耗散功率(Pd):200 mW(封装限值)
  • 直流电流增益(hFE):800 @ 2 mA, 5 V(高增益,低电流区性能优异)
  • 特征频率(fT):100 MHz(良好频率响应)
  • 集电极截止电流(Icbo):100 nA(低漏电流)
  • 集电极饱和电压(VCE(sat)):≈500 mV @ Ic=100 mA, Ib=5 mA
  • 发—基击穿电压(Vebo):5 V
  • 封装:SOT-23

三、典型应用场景

  • 小信号放大(音频前级、传感器信号调理)
  • 低压差分、互补推挽电路中的 PNP 管对称单元
  • 通用开关(低压低电流负载驱动)
  • 节能型便携设备中作为电源管理与电平转换元件

四、封装与引脚说明

采用 SOT-23 小封装,利于表面贴装和高密度布板。为避免引脚误接或封装变种带来的差异,推荐在设计前参照永裕泰最新数据手册确认具体引脚排列与焊盘尺寸。

五、设计与使用注意事项

  • 功耗管理:Pd 仅 200 mW,需注意热阻与散热,避免长期在接近极限功耗下工作;进行 PCB 过孔或铜箔散热设计以降低结温。
  • 饱和与驱动:若作为开关在 100 mA 工作,应提供足够基极电流(示例条件 Ib≈5 mA)以确保低饱和电压。
  • 基极反向电压:Vebo = 5 V,禁止对基极施加过高反向电压以免损坏。
  • 增益与偏置:hFE 在低电流区非常高,适合小信号放大,但实际电路需考虑增益散差并加稳定偏置或反馈。
  • 高频性能:fT≈100 MHz,适用于中高频放大,但在高频设计中仍需考虑寄生电容与封装影响。

六、选型与资料

BC857C(永裕泰)适合对高增益、低漏电、SOT-23 封装有需求的设计。为保证设计可靠性,建议结合厂商完整数据手册进行仿真与样片测试,确认引脚定义、典型特性曲线及热特性后再量产。若需替代件或并联/并行使用方案,请在实际应用中验证热稳定性与电流共享特性。

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