WMSIC Electronic Components

YONGYUTAI MB10S

ModelMB10S
PackageSOP-4
BrandYONGYUTAI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YONGYUTAI MB10S
Type
SOP-4
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YONGYUTAI
Electronic Component
MB10S
Electronic Component
1
Package
SOP-4
Type
Electronic Component
Electronic Component
Bridge Rectifier
Electronic Component
0.195g
Electronic Component
1
Electronic Component
BM0226337802
Current
800mA
Current(Ir)
5uA@1kV
(Vf)
1.1V@1A
Electronic Component
55℃~+150℃@(Tj)
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MB10S 产品概述

一、产品简介

MB10S 是一款单相硅整流桥,适用于小功率交流到直流整流场合。该器件由永裕泰(YONGYUTAI)生产,采用 SOP-4 封装,体积小、安装方便,适合波形整流、直流供电和各种电子电源模块的桥式整流应用。器件设计兼顾高耐压与低漏电,可靠性好,适合工业级温度范围工作。

二、主要参数

  • 工作结温范围:-55℃ ~ +150℃
  • 正向压降(Vf):1.1V @ 1A(典型)
  • 直流反向耐压(Vr):1000V
  • 反向电流(Ir):5μA @ 1kV
  • 非重复峰值浪涌电流(Ifsm):35A
  • 额定整流电流:500mA(持续);资料中亦标注 800mA 可作为短期或特定条件下的参考值
  • 类型:单相整流桥
  • 封装:SOP-4(表面贴装)

三、器件特点

  • 高耐压:1000V 反向耐压适用于高压整流场景与电源前端滤波。
  • 低漏电:在 1kV 下反向电流仅 5μA,适合需低泄漏的测量与高阻负载电路。
  • 良好浪涌能力:35A 的单次浪涌允许器件承受电源启动或短时冲击电流。
  • 宽温度范围:-55℃ 到 +150℃,可满足工业级和恶劣环境使用要求。
  • 封装小巧:SOP-4 便于 PCB 高密度布局与自动化贴装。

四、典型应用场景

  • 小功率开关电源、适配器和充电器的前端整流
  • 仪器仪表及传感器供电模块
  • 工业控制板、家用电器中的辅助电源
  • 直流电源滤波与反向极性保护电路

五、封装与热管理

SOP-4 表面贴装封装利于自动化生产,但散热能力受限。推荐在 PCB 设计时:

  • 在整流桥下方及引脚周围增加铜箔面积或多层内铺铜,形成散热通道;
  • 对于持续工作接近额定电流的应用,考虑在 PCB 上加热沉或在周围预留空气对流空间;
  • 注意焊接温度曲线符合无铅回流规范,避免过热损伤塑封。

六、典型电路与使用要点

  • 推荐在桥的直流输出侧并联电容进行滤波,滤波电容耐压需高于峰值直流电压。
  • 如需降低输出纹波,可配合限流电阻或LC滤波器使用。
  • 在高浪涌场合,可在交流侧加入熔断器或 NTC 限流元件,保护整流桥免受反复冲击。
  • 注意极性识别:SOP-4 封装标识引脚对应关系应参考厂家数据手册,避免接反。

七、注意事项与订购信息

  • 在选型时以厂家最新数据手册为准,特别是关于持续整流电流和热阻等参数;
  • 生产、储存及贴装过程中应采取常规防静电、防潮措施;
  • 订购时注明型号 MB10S、封装 SOP-4、品牌 YONGYUTAI,以确保器件版本与质量一致。

总结:MB10S 提供了高耐压、低漏电与良好浪涌保护的单相整流解决方案,适用于多种小功率与工业级电源场合。正确的 PCB 散热设计与合理的浪涌保护配置能够显著提升器件的长期可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.