WMSIC Electronic Components

YONGYUTAI 5N10

Model5N10
PackageSOT-23-3L
BrandYONGYUTAI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YONGYUTAI 5N10
Type
YONGYUTAI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YONGYUTAI
Electronic Component
5N10
Electronic Component
1
Package
SOT-23-3L
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0226441276
Power Dissipation(Pd)
5W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
100V
Capacitor(Ciss)
212pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

5N10 产品概述

一、概述

5N10 为 YONGYUTAI(永裕泰)出品的 N 沟场效应管,采用 SOT-23-3L 小封装,器件参数面向 100V 及中低功率开关应用。此器件在 4.5V 栅压下导通电阻为 170mΩ,连续漏极电流 5A,耗散功率 5W,适合体积受限且需承受较高电压的电源管理与开关场合。

二、主要电气参数

  • 漏源耐压 Vdss:100V
  • 连续漏极电流 Id:5A(在合适散热条件下)
  • 导通电阻 RDS(on):170 mΩ @ Vgs=4.5V, Id=2A
  • 阈值电压 Vgs(th):2.5V @ Id=250µA(典型阈值,非导通保证)
  • 总栅电荷 Qg:3.3 nC @ Vgs=10V(开关驱动能量参考)
  • 输入电容 Ciss:212 pF;输出电容 Coss:27.5 pF;反向传输电容 Crss:1.6 pF
  • 封装:SOT-23-3L;功耗 Pd:5W(需结合 PCB 散热能力评估)

三、典型应用

  • 开关电源次级或中小功率升降压转换器的低端开关或同步整流
  • 负载开关、DC-DC 开关节点、驱动线圈、继电器替代
  • 电池保护与能量管理中需同时兼顾高压与小封装的场合
  • LED 驱动与小型马达控制(注意平均功耗与散热)

四、驱动与开关特性建议

  • 驱动电压:器件在 4.5V 即有较低的 RDS(on),若系统允许,采用 8–10V 驱动可进一步减小导通损耗;注意 Qg 在 10V 时约 3.3nC,驱动器需能提供相应瞬态电荷。
  • 栅极阻尼:为控制开关过冲与振铃,建议在栅极串联 10–100Ω 的门极电阻,具体取值依据寄生电感与转换速度权衡。
  • 开关损耗:由于器件属于中等 Coss 与 Qg 级别,频率较高时开关损耗不可忽视,建议在高频场合进行功率与温升仿真。

五、热管理与可靠性

  • SOT-23 封装散热能力有限,5W 标称耗散需在良好铜箔与多层板散热设计下才能实现,实际工作中建议对连续大电流进行降额处理并增加散热铜面或热 vias。
  • 在高频或高电流切换中,除了导通损耗外,开关损耗与结温上升会显著影响寿命,应控制结温并做热裕度设计。
  • 建议在使用与调试阶段关注温度、纹波电压与应力循环,必要时加入热保护或电流限制电路。

六、封装与 PCB 布局注意事项

  • 尽量缩短漏、栅、源间走线,减少寄生电感与环路面积以降低 EMI 与振铃。
  • Source 引脚尽可能通过大面积铜箔与多层板导出以利散热,若为高电流路径考虑增加热 vias。
  • 栅极附近放置阻尼电阻与旁路电容,源端放置小的去耦电容以稳定参考,地线应做点对点或星形回流设计。

七、结论与选型建议

5N10 在 100V 等级下提供了较低的导通电阻与适中的开关特性,适用于体积受限且需高压耐受的开关与电源管理场景。若目标应用要求长期大电流或高开关频率,应重点关注 PCB 散热与驱动能力;如需更低 RDS(on) 或更高电流能力,应考虑更大封装或并联方案。使用时请结合实际热闭环测试验证器件在目标工况下的温升与可靠性。

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