Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ESP8266-V3 NodeMCU LUA CH340 ESP-12E WiFi Internet Development Board 4M Flash Serial Wireless Module for Arduino Type-c usb
Configuration
2 options
Configuration
ESP8266-V3(TYPE-C)
Available for RFQ
Technical data
Product details
6
specifications
Core information
- Product name
- ESP8266-V3 NodeMCU LUA CH340 ESP-12E WiFi Internet Development Board 4M Flash Serial Wireless Module for Arduino Type-c usb
- Type
- Electronic Components & Modules
Technical parameters
- Type
- Module
- Origin
- Mainland China
- Condition
- New
- High-concerned chemical
- none
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
Description:
ESP8266 is a highly integrated chip designed for the needs of a new connected world. It offers a complete and self-contained networking solution, allowing it to either host the application or to offload from another application processor.
A great set of tools to develop ESP8266.
NodeMCU is built based on the mature ESP8266 technology to take advantage the abundant resources available on the web.
NodeMCU has ESP-12 based serial WiFi integrated on board to provide GPIO, PWM, ADC, I2C and 1-WIRE resources at your finger tips, built-in USB-TTL serial with super reliable industrial strength CH340 for superior stability on all supported platforms.
ESP8266 is a highly integrated chip designed for the needs of a new connected world.
It offers a complete and self-contained Wi-Fi networking solution, allowing it to either host the application or to offload all Wi-Fi networking functions from another application processor.
ESP8266 has powerful on-board processing and storage capabilities that allow it to be integrated with the sensors and other application specific devices through its GPIOs with minimal development up-front and minimal loading during run-time.
Its high degree of on-chip integration allows for minimal external circuitry, and the entire solution, including front-end module, is designed to occupy minimal PCB area.
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Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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