Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
Embedded Mega 2560 CH340G/ATmega2560 - Compatible with Mega 2560 motherboards. It is built on the Atmel ATmega2560 microcontroller and the USB-UART interface chip CH340G.
The circuit board is compact in size, measuring 38x55mm. This is a very good solution to enable your final project to be welded onto the prototype board.
The motherboard function is similar to that of the Arduino Mega 2560. It is an embedded motherboard, but equally stable and uses the original ATmega2560 chip (16 MHz).
This board uses the chip CH340G as the converter UART-USB. When you operate at a frequency of 12Mhz, it provides stable data exchange results (drivers need to be installed on the computer).
Mega PRO (Embedded) 2560 CH340G/AT Mega 2560 - Connect to a computer via a microUSB cable (almost suitable for all Android smartphones).
You can power the circuit board or the pins through the MicroUSB connector. The voltage regulator (LDO) can handle input voltages ranging from 6V to 9V (with a peak of 18V) DC. The output current is 5V - approximately 800mA, and 3.3V - approximately 800mA (please note that the higher the input voltage, the lower the output current). This will provide reliable power for most of your initial projects.
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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