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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
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Product Description: Breadboards are used to build circuits that require multiple different voltages for power supply.
When building circuits with breadboards, it is often necessary to supply multiple different voltages, such as +-5V for op-amps, 3.3V or 1.8V for MCUs and external sensors, etc. For this reason, we have developed this module, and use the TypeC interface, which is more widely used nowadays, to provide power input for the module.
Technical specifications
Power supply: USB-TypeC interface
Power supply: Recommended to use mobile phone charging head or charging treasure, etc.
Output voltage: +-5V, 1.8V, 3.3V
With a power switch, press the power on, press up the power off, corresponding to the power indicator with M3 mounting screw holes, can be customised to install for regular medium-sized or multiple splicing breadboards

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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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