Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
Parameters:
Input: DC 25V (maximum)
Output: 3.3V/5V/9V/12V
Current output: 8A (maximum)
Quiescent current: 0.1mA
Conversion efficiency: up to 95%
Low ripple: 500KHZ
Output short-circuit protection
Built in over temperature protection
Operating temperature: -40 ° C to+85 ° C
5/9/12/24V optional
Main uses: low-voltage voltage reduction, unmanned power supply, MCU power supply, ripple requirements, slightly higher circuits
Attention:
The module has a relatively small volume and limited heat dissipation area. It is normal for high-power output to generate heat. The back of the board can be directly attached to the surface of a fixed object to enhance heat dissipation.
The board has a thickness of 7.4mm and includes heat dissipation fins. For applications with high power consumption requirements, the output LED indicator light can be removed.
Module interface:
VIN+: DC input positive pole 6V-25V (must be higher than output voltage by more than 1V).
GND: DC input negative pole, connected to output negative pole.
+(OUT+): DC output positive pole.
-(GND): DC output negative electrode, connected to input negative electrode.
Package include:
1pcs x High Efficiency Output DC-DC 25V to 3.3V/5V/9V/12V 8A Buck Step Down Converter Board Module
Instructions for use:
1.The input of the product should be greater than the output voltage, and it is best to maintain a voltage difference of more than 1V. The input should not be connected in reverse, and the circuit should be connected in reverse.
2.It is best to disconnect the power supply when wiring, otherwise when the voltage is high, it is easy to spark, which will have a certain risk of hitting the chip and breaking it down.
3.The wiring should not be too thin to ensure that the wire can withstand the corresponding current.
4.Protect the inductive load to avoid excessive reverse electromotive force exceeding the range of the chip.
5.The higher the power used by the module, the closer the current is to the maximum current. The heat will increase, so pay attention to heat dissipation when using.
6.When there is no external heat dissipation, it is recommended to continuously use a current below 5A. If the current exceeds 5A, additional heat dissipation is required, otherwise overheating protection output will occur.
7.The recommended voltage for use is below 24V. If the power supply voltage is not very stable and the peak voltage exceeds 25V, it will trigger the internal overvoltage protection of the chip. For stable operation, some margin should be left appropriately.
8.When encountering problems during use, contact customer service must cooperate with them to provide wiring pictures, videos, etc. It is not acceptable to only provide text information.
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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