Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
Features:
1.Based on the RP2350A microcontroller core chip, all unoccupied pins are led out in a very small board size.
2. Adopting a half hole process, it can be welded onto custom boards.
3. Adopting Type-C interface, keeping up with the trend of the times, there is no need to worry about forward and backward insertion.
4. Unique dual core and dual architecture, equipped with dual core processors, with a clock operating frequency of up to 150MHz.
5. Supports C/C++, MicroPython comes with a comprehensive SDK and open-source tutorials, making it easy to get started and quickly embed into applications.
Parameter:
Adopting RP2350A microcontroller chip
Unique dual core and dual architecture, equipped with dual core ARM Cortex-M33 processor and dual core Hazard3 RISC-V processor, with a clock operating frequency of up to 150MHz
Built in 520KB SRAM and 4MB on-chip Flash
Adopting Type-C interface, keeping up with the trend of the times, no need to worry about forward and backward insertion
Stamp hole design, can be directly welded and integrated into the user's self-designed base plate
Supports USB 1.1 hosts and devices
Support low-power sleep and sleep mode
Can be recognized as a large capacity storage device through USB for drag and drop downloads
29 GPIO pins of RP2350A can be led out (20 can be led out through pin headers, the rest can only be soldered out)
2 SPI, 2 I2C, 2 UART, 4 12 bit ADCs, 24 controllable PWM channels
Accurate on-chip clock and timer
Built in temperature sensor
On-chip accelerated floating-point library
12 programmable I/O (PIO) state machines for custom peripheral support
Voltage regulator chip LDO 800mA
Appearance size 23.5mm * 18mm
Package include:
1X development board
Specification:
Adopt RP2040 microcontroller chip
Equipped with a dual-core ARM Cortex M0+ processor, the operating frequency is up to 133MHz flexible clock. Built-in 264KB SRAM and 2MB on-chip Flash
The real stamp hole design can be directly welded and integrated into the bottom plate designed by the user.
USB1.1 host and device support
Supports low power sleep and hibernate modes
Drag-and-drop program download via USB recognition as mass storage
29 GPIO pins of RP2040 are led out (20 can be led out through pin headers, and the rest can only be led out by soldering)
2 SPIs, 2 12Cs, 2 UARTs, 4 12-bit ADCs, 16 controllable PWM channels.
Accurate on-chip clocks and timers
Temperature Sensor
On-chip accelerated floating-point library
8 programmable I/O (PIO) state machines for custom peripheral support
Package Includes:
1*Raspberry Pi RP2040-Zero microcontroller PICO development board without pin header

Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products