Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
一、产品简介
EL817(B)-F 是由台湾亿光(EVERLIGHT)公司提供的一款高性能的光电耦合器。本产品采用DIP-4封装,主要应用于各种电子设备中,有效地实现信号的隔离与传输。光电耦合器的设计宗旨在于通过光信号的传输来隔离不同电路,保护敏感元件,确保系统的稳定性与可靠性。EL817(B)-F 具备强大的输出能力,额定输出电流可达50mA,适合于多种应用场景。
二、技术规格
封装: DIP-4
输出类型: 光电三极管
工作电流: 最大输出电流为50mA
导通电压: 1.2V
传输特性: 具有较高的输入-输出隔离
三、主要应用领域
EL817(B)-F 可广泛应用于多种领域,以下是几个主要的使用场景:
微控制器与家电控制
信号隔离
工业自动化
消费电子
四、优势与特色
高电流输出:EL817(B)-F 支持高达50mA的输出,适合需要较大驱动电流的应用。
良好稳定性:在广泛的工作环境下,确保可靠性和稳定性,适合各种电子设备的长时间使用。
光隔离特性:通过光电隔离,消除地环路干扰,使系统更加安全、抗干扰能力增强。
五、设计注意事项
在使用EL817(B)-F 进行设计时,建议注意以下事项:
输入电流:确保输入端电流适配,以便于稳定的光信号产生并实现有效的输出。
热管理:在高负载工作时,需要考虑到热量的散发,避免影响元件的使用寿命。
PCB布局:合理布局,以减少信号干扰,保证良好的信号传输质量。
结论
EL817(B)-F 是一款功能强大、性能稳定的光电耦合器,广泛应用于各种电子系统中,能够有效地实现信号传输和电气隔离。其高电流输出和良好的隔离特性使得它成为现代电子设计中不可或缺的元件之一。无论是在工业控制、消费电子还是其他电子项目中,EL817(B)-F 都展现出其优越的性能和广泛的适用性。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products