WMSIC Electronic Components

ADI/LINEAR DS1302ZN+T&R DS1302ZN

ModelDS1302ZN+T&R
PackageSOIC-8
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR DS1302ZN+T&R
Type
ADI/LINEAR
Minimum package
2500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
DS1302ZN+T&R
Electronic Component
1
Package
SOIC-8
Electronic Component
Real-Time Clock (RTC)
Electronic Component
0.219g
Electronic Component
1
Features
Power Management and Battery; SRAM / NVRAM
Electronic Component
BM0258702471
Operating Temperature
40℃~+85℃
Operating Voltage
2V~5.5V
Operating Current
300nA
Interface Type
SPI
Crystal Oscillator Type
Electronic Component
Output
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DS1302ZN+T&R 产品概述

一、产品简介

DS1302ZN+T&R 是一款低功耗的 Trickle‑Charge 实时时钟芯片(Timekeeping Chip),采用 SPI 串行接口并需外接石英晶体振荡器来实现时间基准。器件工作电压宽泛(2.0V~5.5V),适配各类单片机系统与电池/超级电容备份方案,针对需要长时间低功耗时间保持的应用进行了优化。

二、主要技术参数

  • 接口类型:SPI 串行通信
  • 工作电压:2.0 V ~ 5.5 V
  • 工作电流:约 300 nA(典型)
  • 静态电流 (Iq):约 1 nA(待机/掉电保持)
  • 晶振:外置(需配置合适的 32.768 kHz 石英晶体)
  • 闹钟输出:无独立闹钟输出,需要主控轮询实现唤醒逻辑
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:SOIC-8
  • 描述:Trickle‑Charge 时间保持芯片,支持电池/超级电容备份
  • 品牌:ADI(亚德诺)/LINEAR(根据提供信息)

三、关键特点

  • 极低功耗:器件在正常计时与待机状态下电流微乎其微,利于电池寿命延长与长期断电保持。
  • Trickle‑Charge 支持:内置或兼容的涓流充电功能,便于对后备电源(如钮扣电池或超级电容)进行简易充电管理(具体充电参数应参考厂商资料与电源规范)。
  • 宽电压范围:2.0 V ~ 5.5 V 的供电范围使其能在多种系统电源架构中可靠工作。
  • 外置晶振:外接标准 32.768 kHz 石英晶体,便于实现高精度、长期稳定的时间基准。
  • 标准封装:SOIC‑8 方便在常见 PCB 布局与自动化贴装中使用。

四、典型应用场景

  • 工业控制与数据采集设备的时间戳功能
  • 低功耗物联网节点、传感器网关的本地实时时钟
  • 便携式电子产品、手持设备的系统时间保持
  • 智能抄表、安防设备、仪表盘等需长时间可靠计时的终端设备

五、设计与使用建议

  • 晶振选型:使用标准 32.768 kHz 石英晶体,注意晶体负载电容与走线匹配,避免外界干扰影响频率稳定性。
  • 供电与备份:若使用涓流充电功能,为保护后备电源(如锂纽扣或超级电容),应根据电源制造商建议配置限流与保护元件,避免过充或电流过大。
  • PCB 布局:晶体与相关电容应尽量靠近芯片对应引脚,走短且对称的轨迹,模拟地与数字地分开并在电源入口处做去耦。
  • 软件设计:由于无独立闹钟输出,系统需通过 SPI 定时轮询或结合主控低功耗唤醒策略实现定时事件管理。
  • 功耗优化:充分利用器件待机/掉电保持特性,将主控器件置低功耗状态以实现整体系统长续航。

六、封装与环境适应性

  • 封装形式:SOIC‑8,适合批量表面贴装生产。
  • 工作温度范围:-40 ℃ 到 +85 ℃,适合大多数工业与商用环境。请确保在极端温度条件下验证时钟精度与备份电源行为。

七、选型与采购注意事项

  • 在选购前请核对完整数据手册,确认 Trickle‑Charge 的具体行为、电流/电压限制与安全要求。
  • 对精度、温度漂移有严格需求的应用,应参考器件频率温度特性或考虑外部校准策略。
  • 关注封装代码与供货形式(带卷带 + T&R)以满足生产与库存管理需求。

如需更详细的电气规范、引脚定义、电路参考设计或样板 PCB 布局建议,请提供您实际的使用场景或索取完整器件数据手册后,我可给出更具体的硬件与软件实现方案。

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