WMSIC Electronic Components

ADI/LINEAR DS1302Z+T&R DS1302Z

ModelDS1302Z+T&R
PackageSOIC-8
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR DS1302Z+T&R
Type
ADI/LINEAR
Minimum package
2500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
DS1302Z+T&R
Electronic Component
1
Package
SOIC-8
Electronic Component
Real-Time Clock (RTC)
Electronic Component
0.219g
Electronic Component
1
Features
Power Management and Battery; SRAM / NVRAM
Electronic Component
BM0257647296
Operating Temperature
0℃~+70℃
Operating Voltage
2V~5.5V
Operating Current
300nA
Interface Type
SPI
Crystal Oscillator Type
Electronic Component
Static Current(Iq)
1nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DS1302Z + T&R 产品概述

一、产品简介

DS1302Z 为一款低功耗串行实时时钟(RTC)器件,封装为 SOIC-8,常以 T&R(带卷)方式供货。器件集成了实时时钟/日历、31 字节非易失时钟 RAM 及电池旁路/涓流充电功能,适用于需要电池保持时间运作的嵌入式系统与消费电子。基础参数如下(按用户信息):

  • 接口类型:SPI(3 线类串行接口兼容)
  • 工作电压:2.0 V ~ 5.5 V
  • 工作电流:300 nA(时钟运行低功耗)
  • 晶振:外置(32.768 kHz 晶体)
  • 工作温度:0 ℃ ~ +70 ℃
  • 静态电流(Iq):1 nA
  • 描述要点:Real Time Clock、31-byte Clock/Calendar、Trickle Charger、NV Timekeeping RAM、8-Pin SOIC、T&R
  • 品牌示例:ADI(亚德诺)/LINEAR(市场亦有其他厂商或兼容件)

二、主要特点

  • 精确的时钟/日历功能,支持秒、分、时、日、月、年等寄存器存储与更新;寄存器通常以 BCD 形式存放。
  • 31 字节非易失性 RAM,可用于存放配置信息或小量系统数据,断电后保持内容。
  • 内置涓流充电器,可为外接后备电池或纽扣电池提供安全的充电/维持机制(需按规格选用电阻、二极管等外部元件)。
  • 低功耗设计:工作模式与待机模式下电流极小,适合电池供电场景。
  • 外部 32.768 kHz 晶体振荡器输入,晶体及加载电容需按推荐值选配以保证频率精度。
  • 串行通信,节省管脚,便于微控制器接口设计。

三、引脚与封装

  • SOIC-8 标准引脚排列,便于 PCB 布局与自动化贴装。
  • 典型引脚:VCC、GND、X1、X2(晶体引脚)、RST/CE(片选/使能)、CLK(时钟输入)、IO(双向数据)、VBAT(备份电源)等。
  • T&R(Tape & Reel)适合批量 SMT 生产线使用,便于自动上料。

四、关键应用与选型建议

  • 适用场景:便携式设备、家电、仪器仪表、数据记录设备及任何需长期维护时间信息的系统。
  • 若系统对时间精度要求高,注意晶体质量、加载电容及温度漂移影响;必要时选择温度补偿或校时机制。
  • 电源管理:当系统主电源断开时,确保备份电池/电容能可靠供电;为避免反向电流,建议采用肖特基二极管或专用电源开关方案。

五、使用与注意事项

  • 晶体:优先采用 32.768 kHz AT-cut 晶体,并按数据手册推荐的加载电容匹配,以降低频率误差。
  • 串行时序:对寄存器进行读写时需严格遵循器件时序要求(CE/CLK/IO 时序),避免数据错乱。
  • 涓流充电器:配置时需按照规格选择外接电阻和二极管,避免为不可充电电池误充电。
  • 去耦与 PCB 布局:VCC 与 GND 处应放置旁路电容,晶振走线短且远离高速信号,GND 层完整以保证稳定性。

六、典型电路说明(概述)

  • 晶体两端接 X1、X2,晶体旁配合两只加载电容接地;VCC 与 VBAT 之间通过二极管或电源开关实现自动切换;IO 线可直接与 MCU 的 SPI/GPIO 通过电平兼容接口通信;提供去耦电容于 VCC 与 GND 之间。

七、包装与采购信息

  • 封装:SOIC-8,便于 SMT 量产。
  • 供应形式:T&R(带卷)适合贴片机自动化贴片;亦可少量散装采购。
  • 采购时注意器件型号后缀(温度等级、包装方式)与真伪鉴别,必要时索取数据手册以核对管脚与时序细节。

总结:DS1302Z(SOIC-8)以其集成 RTC、NV RAM 与涓流充电功能、超低静态电流特性,非常适合对低功耗与电池后备有要求的嵌入式应用。推荐在设计初期仔细阅读器件数据手册,完成晶体和电源管理的细节验证,以确保长期运行可靠性。

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