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ADI/LINEAR ADL5350ACPZ-R7 ADL5350ACPZ
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ADI(Analog Devices) / LINEAR ADL5350ACPZ-R7
- Type
- ADI/LINEAR
- Minimum package
- 3000 编带
Technical parameters
- IP3
- 25dBm
- P1dB
- 19.8dBm
- Electronic Component
- Electronic Component
- Electronic Component
- ADI(Analog Devices) / LINEAR
- Electronic Component
- ADL5350ACPZ-R7
- Electronic Component
- 1
- Package
- LFCSP-8
- Electronic Component
- RFMixer
- Electronic Component
- 1.1g
- Electronic Component
- 1
- Features
- Integrated LO Buffer; Single-Ended / Differential Interface Integrated
- Electronic Component
- BM0259012482
- Noise Figure
- 6.5dB
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2.7V~3.5V
- Operating Current
- 19mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ADL5350ACPZ-R7 产品概述
一、产品概述
ADL5350ACPZ-R7 是来自 ADI（亚德诺/LINEAR）的一款高性能 RF 混频器芯片，定位于移动通信前端及收发系统的下变频/混频应用。器件工作电压范围宽（2.7V~3.5V），静态工作电流约 19mA，工作温度范围 -40℃ 到 +85℃，适合工业级与商业级移动终端、基站收发模块等场景。
二、主要性能参数
- RF 频率范围：750 MHz ~ 2.05 GHz
- IF 频率范围：30 MHz ~ 380 MHz
- LO 频率范围：500 MHz ~ 2 GHz
- 小信号增益/损耗：6.8 dB（典型）
- 输入 1 dB 压缩点（P1dB）：19.8 dBm
- 三阶互调点（IP3）：25 dBm
- 噪声系数（NF）：6.5 dB（典型）
- 工作电压：2.7 V ~ 3.5 V
- 工作电流：19 mA（典型）
- 工作温度：-40℃ ~ +85℃
- 封装：LFCSP-8（3 x 2 mm）
三、适用场景
本器件适合 GSM、CDMA 等窄带/宽带移动通信前端混频，亦可用于便携式无线电、无线宽带接收、射频测试仪器和小型基站收发链路。其频段覆盖 750 MHz~2.05 GHz，满足多种蜂窝频段与近距离无线通信需求。
四、封装与系统集成
LFCSP-8 小型封装（3x2 mm）便于高密度 PCB 布局与自动贴装，有利于移动终端与模块化设计中对空间和成本的双重约束。建议在 PCB 布局中靠近器件引脚做良好电源去耦和 RF 地平面，以保证稳定性与低噪声性能。
五、设计与使用注意事项
- LO 驱动与匹配：保证稳定的 LO 源及适当的功率匹配，以实现标称增益与线性性能；避免过驱或欠驱导致性能偏移。
- 射频输入/输出：做好输入输出的阻抗匹配与滤波，避免镜像及带外干扰进入。
- 电源管理：在供电引脚处采用低 ESR 去耦电容，靠近器件放置，以抑制电源噪声影响。
- 热管理：虽然功耗较低，但在高温或封装密集的系统中仍需考虑散热和可靠性设计。
六、性能优化建议
- 在系统层面通过前端低噪放大器（LNA）和后端滤波器配合，能有效改善整体接收灵敏度与选择性。
- 对于高线性要求的应用，可在 LO 与 RF 端加入可控衰减器或前置限制器，以保护器件并维持线性输出。
- 进行版级 EM 仿真与测试，优化地平面与引线走线，降低寄生与耦合影响。
七、总结
ADL5350ACPZ-R7 以其宽频段覆盖、较高线性指标（P1dB、IP3）和小型封装特点，适合用于多种移动通信和无线接收前端设计。合理的匹配、去耦与热管理能使其在实际应用中发挥最佳性能，满足对增益、线性与功耗的平衡需求。
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