WMSIC Electronic Components

ADI/LINEAR MAX3077EESA+T MAX3077EESA

ModelMAX3077EESA+T
PackageSO-8
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR MAX3077EESA+T
Type
ADI/LINEAR
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
MAX3077EESA+T
Electronic Component
1
Package
SO-8
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.212g
Electronic Component
256
Electronic Component
1
Electronic Component
BM0258850019
Operating Temperature
40℃~+85℃
Operating Voltage
3V~3.6V
Receiver
1
Data
16Mbps
Communication
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX3077EESA+T 产品概述

一、产品简介

MAX3077EESA+T 是一款由 ADI(Analog Devices / Linear)系列的低功耗差分收发器,支持 RS-422 和 RS-485 标准,集成 1 路驱动器与 1 路接收器,可在片上实现全双工数据传输。器件工作电压范围为 2.97V–3.63V(通常称作 3.0V–3.6V),封装为 SO-8(NSOIC-8),适合工业级嵌入式和通讯接口应用。

二、主要参数与特性

  • 类型:收发器(1 驱动器 / 1 接收器)
  • 通讯模式:全双工,支持同时发送与接收
  • 工作电压:2.97V–3.63V(3.0V ±0.3V)
  • 数据速率:最高可达 16 Mbps,适合高速差分信号应用
  • 节点支持:最多可驱动 256 个节点(RS-485 网络拓扑下)
  • 静态电流:待机/静态电流约 800 µA,适合低功耗系统
  • 静电保护:器件具备 ±15 kV 静电防护能力(在系统设计中可显著提高抗扰性)
  • 工作温度:工业级范围 −40 ℃ 至 +85 ℃
  • 封装:SO-8(NSOIC-8),便于 PCB 布局与自动化焊接

三、典型应用场景

  • 工业自动化现场总线(PLC 与分布式 I/O)
  • 工业以太网或串行网关中的 RS-422/RS-485 接口
  • 仪器仪表、楼宇自控与安防系统中的长距离差分通讯
  • 电力监控、数据采集(SCADA)与多节点网络拓扑

四、设计与布局建议

  • 差分线对应采用恒定阻抗布线,贴近并尽量短,避免尖角与电流环路。
  • 在传输线两端使用匹配终端电阻(常见值 120 Ω),并在需要时加入偏置(fail-safe)电阻以确保总线空闲时接收端为确定电平。
  • 电源侧靠近 VCC 引脚放置 0.1 µF 陶瓷去耦电容,并考虑 1 µF 以上的电解或钽电容以抑制低频噪声。
  • 对于高节点数(接近 256)的网络,应评估信号完整性与反射,必要时使用中继器或分段总线设计。
  • ESD 与浪涌保护:虽然器件具备 ±15 kV 静电防护,仍建议在易受干扰的接口处增加 TVS 二极管或共模抑制器件以增强系统可靠性。
  • 热管理:在高密度布板或高环境温度下,注意器件周围散热空间与热源隔离,确保在 −40 ℃ 至 +85 ℃ 范围内稳定工作。

五、可靠性与封装

SO-8(NSOIC-8)小外形封装利于自动化生产与焊接一致性;工业级温度与良好的静电防护使其适合苛刻环境长期运行。在批量使用前,应结合 EMC/ESD、温度循环与振动等可靠性测试来验证在目标系统中的稳定性。

六、总结

MAX3077EESA+T 以其 3V 低压供电、高达 16 Mbps 的速率、支持多达 256 节点以及低静态电流(约 800 µA)等特点,适合对功耗和抗扰性有较高要求的工业通信系统。合理的终端匹配、去耦与 ESD 保护设计能进一步发挥该收发器在现场总线与长距离差分通信中的性能与可靠性。若需与具体系统电气参数(如共模电压范围、驱动电流、热阻等)匹配,建议参考厂商详细数据手册并进行实验验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.