WMSIC Electronic Components

ADI/LINEAR MAX485ESA+T MAX485ESA

ModelMAX485ESA+T
PackageSOIC-8
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR MAX485ESA+T
Type
ADI/LINEAR
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
MAX485ESA+T
Electronic Component
1
Package
SOIC-8
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.219g
Electronic Component
32
Electronic Component
1
Features
Tx / Rx
Electronic Component
BM0257666528
Operating Temperature
40℃~+85℃
Operating Voltage
4.75V~5.25V
Receiver
1
Data
2.5Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX485ESA+T 产品概述

一、概述

MAX485ESA+T 是一款适用于 RS-422/RS-485 差分总线的低功耗收发器,来自 ADI(原 Maxim/LINEAR)系列。器件为 1 驱动器、1 接收器的半双工/单端点差分收发结构,提供受限上升/下降斜率(slew‑rate limiting)以降低电磁干扰(EMI),并在工业级温度范围内稳定工作,适合多节点现场总线和长距离通信应用。

二、主要参数

  • 类型:收发器(RS-422/RS-485)
  • 驱动器数:1;接收器数:1
  • 工作电压:4.75V ~ 5.25V(典型 5V 供电)
  • 数据速率:最高 2.5 Mbps
  • 工作温度:-40℃ ~ +85℃(工业级)
  • 封装:SOIC-8(标准引脚排列,包含 DE/RE/DI/RO/A/B/VCC/GND)
  • 品牌:ADI(Analog Devices / LINEAR)
  • 额外特性:低功耗待机、受控上升/下降沿以减少反射与辐射、接收器失效保护(failsafe)以保证开路或短路情况下的确定性输出

三、功能特点与优势

  • Slew‑rate 限制:限制驱动器边沿速率,有效降低长线上的高频分量,从而减小辐射和总线反射,提高电磁兼容性(EMC)表现。
  • 低功耗设计:待机或禁能模式下消耗极小电流,适合对功耗敏感的系统。
  • 多节点兼容:器件设计支持小单位负载(unit‑load),便于在同一总线上并联多个节点,扩展系统规模。
  • 工业级可靠性:宽温度范围与稳健的总线容忍能力,适用于工业现场复杂电磁与温度环境。
  • 易用的控制接口:外部 DE/RE 控制实现发送/接收切换,适配典型的 MCU/FPGA 驱动逻辑。

四、典型应用场景

  • 工业现场总线与 PLC 通信
  • 楼宇自动化、楼宇控制器之间的串行链路
  • 电表与能量采集系统(遥测/抄表)
  • 点售/计费终端、POS 设备间差分链路
  • 运动控制与驱动器通信、测试与测量仪器的差分接口

五、设计注意事项

  • 终端匹配:长线或高速链路应在总线两端加阻性终端匹配(典型 120Ω),减少反射。
  • 偏置电阻:为保证失效保护工作,应在总线上采用适当的偏置电阻(fail‑safe biasing),避免空闲时总线悬浮。
  • 布线与差分对:差分线对走线应等长并尽量靠近,避免不必要的回流环路;保持阻抗连续性以减小串扰与反射。
  • 去耦与供电:VCC 旁放置合适的旁路电容(如 0.1 µF/1 µF),靠近器件引脚,保证瞬态供电稳定。
  • 保护措施:若部署在长线或恶劣环境中,建议增加 TVS 或浪涌保护,防护共模冲击与雷击干扰。
  • 控制时序:DE/RE 的控制需要满足发送/接收切换的建立/保持时间要求,避免数据被截断。

六、封装与订购提示

MAX485ESA+T 为 SOIC‑8 工业封装,+T 后缀通常表示卷带/盘装(tape‑and‑reel)供货,便于自动贴片生产。订购时确认温度等级、包装形式及供应商信息,若对 ESD、绝缘或特定认证有要求,可在采购前向渠道索取完整数据手册与器件可靠性报告。

总结:MAX485ESA+T 凭借受控斜率、低功耗及工业级可靠性,是构建抗干扰能力强、可扩展差分总线系统的常用选择。在设计时关注终端匹配、偏置与布线细节,可最大限度发挥其性能。

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