WMSIC Electronic Components

ADI/LINEAR MAX17504ATP+T MAX17504ATP

ModelMAX17504ATP+T
PackageQFN-20-EP(5x5)
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR MAX17504ATP+T
Type
ADI/LINEAR
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
MAX17504ATP+T
Electronic Component
1
Package
QFN-20-EP(5x5)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.145g
Electronic Component
1
Features
Built-in LDORegulator; Frequency Synchronous
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0258724320
Operating Temperature
40℃~+125℃
Operating Voltage
4.5V~60V
Switching Frequency
100kHz~2.2MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX17504ATP+T 产品概述

一、概述

MAX17504ATP+T 是 ADI/Linear(原 Maxim)推出的一款高输入电压、同步降压稳压器,适用于工业与汽车等需要宽电压范围和高集成度的场合。器件支持 4.5V 至 60V 的输入,最高可输出 3.5A 连续电流,内部集成功率开关,输出电压可通过外部反馈电阻调节。最大开关频率可达 2.2MHz,器件工作温度范围为 -40℃ 至 +125℃,静态电流仅 118μA,适合对待机功耗有要求的系统。

二、主要特性

  • 宽输入电压:4.5V ~ 60V,适合汽车电源(含瞬态)、工业总线及高压点供电。
  • 输出电流:最高 3.5A,适配中高功率负载。
  • 同步降压架构,内部集成开关管,无需外置功率MOSFET。
  • 可调输出:通过外部分压电阻设定输出电压,灵活满足不同电压轨需求。
  • 开关频率可编程:100kHz ~ 2.2MHz,用户可在效率与外设体积之间权衡。
  • 低静态电流:Iq = 118μA,利于降低空载/待机功耗。
  • 宽工作温度:-40℃ ~ +125℃,符合汽车及工业级应用要求。
  • 封装:QFN-20-EP (5x5),带裸露散热焊盘,便于热管理与自动化贴装。

三、典型电气与性能要点

MAX17504 在中等负载条件下可实现较高转换效率(效率受输入电压、输出电压、开关频率与电感选择影响)。选择较高的开关频率可减小电感和输出电容体积,但会增加开关损耗与器件发热;低频工作则在重载下效率更优。建议电感峰值/连续电流容量要高于最大输出电流以保证稳定性与热裕量。

四、应用场景

  • 汽车电子(车载模块、摄像头、电源管理),需适应电压瞬变与宽电压输入。
  • 工业控制与测控设备(PLC、传感器供电、通讯接口)。
  • 通信基站周边电源、仪器仪表及嵌入式系统电源模块。
  • 需要小封装、高密度电源管理的便携或板载方案。

五、封装与热管理

QFN-20-EP (5x5) 带较大裸露焊盘(EP),用于散热与地连接。为保证长期可靠性与热性能,应在 PCB 下方设计热盲 vias 将散热焊盘与内部/底层铜皮连通,放置足够铜面积并进行回流焊贴装。器件在高输入电压或高负载时会产生较大功耗,需评估结温并在必要时采用散热措施。

六、设计与布局建议

  • 输入电容靠近 VIN 引脚与地端放置,选用低 ESR 电容以抑制开关瞬态。
  • 开关节点(SW)与电感之间走线要短且宽,减少寄生电感/回路面积。
  • 输出电容靠近 VOUT 与地,保证环路稳定性与低输出纹波。
  • 反馈分压网络和补偿元件布局要靠近芯片反馈引脚,避免噪声耦合。
  • 根据实际工作条件选择合适电感和电容温升、续流能力及耐压等级。

七、采购与替代

  • 完整型号:MAX17504ATP+T,品牌:ADI(原 Maxim/Linear),封装:QFN-20-EP (5x5),通常以卷带(Tape & Reel)供货,适合自动化贴片生产。
  • 替代方案可在同类高压降压控制器中寻找,但需注意输入耐压、输出电流、开关频率、封装与保护功能的匹配。

总结:MAX17504ATP+T 以其宽输入电压、高开关频率、低静态电流与集成功能,在工业与汽车等需要高可靠性与小尺寸电源解决方案的场合具有明显优势。合理的器件选型、PCB 布局与热设计是实现稳定高效工作的关键。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.