WMSIC Electronic Components

ADI/LINEAR DS18B20+ DS18B20

ModelDS18B20+
PackageTO-92
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR DS18B20+
Type
ADI/LINEAR
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
DS18B20+
Electronic Component
1
Package
TO-92
Electronic Component
Temperature Sensor
Electronic Component
±0.5℃
Electronic Component
0.224g
Electronic Component
1
Features
Output
Electronic Component
BM0257686136
Operating Voltage
3V~5.5V
Current
1uA
Interface Type
Bus
Electronic Component
55℃~+125℃
Resolution
12bit

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DS18B20+ 产品概述

一、产品简介

DS18B20+ 是一款数字温度传感器,采用单总线(1-Wire)通信,3 引脚 TO-92 封装,常以散装/袋装方式供应。器件适用温度范围为 -55℃ 到 +125℃,工作电压 3.0V 至 5.5V,品牌信息按需求可见 ADI(亚德诺)/LINEAR。凭借单线通信、多点挂载和片内数字化温度转换,DS18B20+ 适合各种环境温度测量与控制场景。

二、主要规格与性能

  • 测温范围:-55℃ ~ +125℃(量程覆盖广泛,适合严苛环境)
  • 工作电压:3.0V ~ 5.5V(兼容常见 MCU 电压)
  • 接口类型:单总线(1-Wire),一根数据线可实现供电与通信(支持寄生供电或常规供电)
  • 分辨率:可编程 9 至 12 位(9 位:0.5℃/步;10 位:0.25℃/步;11 位:0.125℃/步;12 位:0.0625℃/步)
  • 精度:典型 ±0.5℃(在 -10℃ ~ +85℃ 范围内)
  • 转换时间:最高约 750 ms(12 位分辨率时)
  • 唯一序列号:每片集成 64 位 ROM,支持同一总线上多个器件共存且可单独寻址

三、封装与引脚定义

封装:TO-92 直插式,3 引脚,便于面包板与穿孔板装配。
引脚(面向扁平面、引脚向下时,自左至右):

  1. GND(接地)
  2. DQ(单总线数据引脚)
  3. VDD(电源正极,或用于常规供电)

常规接法建议在 DQ 与 VDD 之间并联一个约 4.7kΩ 的上拉电阻;使用寄生供电模式时,设备由 DQ 和 GND 提供能量,应注意总线时序和负载能力。

四、功能特点

  • 单线总线结构,硬件接口简单,便于多点布署
  • 支持寄生供电以减少连线数量(但会限制性能与布线长度)
  • 可编程测量精度,灵活折中测量速度与分辨率
  • 片内数字化输出,无需外部 ADC,直接以数字形式读取温度值
  • 工作温度范围广,且具有可靠的工业级温度测量能力

五、典型应用

适用于空调与暖通(HVAC)系统、工业温度监控、环境监测、家电温控、温度记录器与远程传感节点等场景,尤其在需要多点布置但引脚资源有限的系统中具有明显优势。

六、设计与使用建议

  • 推荐在 DQ 上使用 4.7kΩ 上拉电阻以保证通信稳定;长线通信时可适当减小电阻或采用总线驱动器
  • 若使用寄生供电,避免在转换期间总线被过度拉低,且尽量缩短总线长度以确保供电可靠
  • 供电去耦与地线布线要做好,以降低噪声对测温精度的影响
  • 在多节点总线上读取时,先通过 ROM 指令寻址指定器件,再发起温度转换,避免总线冲突
  • 注意工作环境的机械应力与潮湿,必要时采用防护罩或密封封装

七、采购与替代注意事项

DS18B20+ 为成熟器件,市场上有多个厂商和不同封装形式;采购时核对出厂型号、温度等级、封装(TO-92)和供应商资质(如 ADI/LINEAR 或其他正规厂家)。若对热响应速度、封装防护或安装方式有特殊要求,可考虑封装化或表面贴装版本作为替代。

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