WMSIC Electronic Components

ADI/LINEAR DS1307Z+T&R DS1307Z

ModelDS1307Z+T&R
PackageSOIC-8
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR DS1307Z+T&R
Type
ADI/LINEAR
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
DS1307Z+T&R
Electronic Component
1
Package
SOIC-8
Electronic Component
Real-Time Clock (RTC)
Electronic Component
0.219g
Electronic Component
1
Features
Power Management and Battery; SRAM / NVRAM; Programmable Clock Output
Electronic Component
BM0257371894
Operating Temperature
0℃~+70℃
Operating Voltage
4.5V~5.5V
Operating Current
1.5mA
Interface Type
I2C
Crystal Oscillator Type
Electronic Component
Static Current(Iq)
300nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DS1307Z+T&R 产品概述

一 概要

DS1307Z+T&R 是一颗基于 I²C 总线的实时钟(RTC)芯片,提供完整的时钟/日历功能并附带 56 字节电池备份 SRAM,适用于对时间保持与低功耗待机有要求的嵌入式系统。该器件工作电压范围为 4.5V~5.5V,典型工作电流约 1.5mA(活动模式),静态电流(Iq)仅 300nA(电池备份模式),要求外接 32.768kHz 石英晶振,温度范围为 0℃~+70℃,封装为 SOIC-8。该型号常由 ADI(Analog Devices)/Linear 品牌提供,适合工业和消费类产品中的时钟保持与数据备份场景。

二 主要功能亮点

  • I²C(双线)串行接口,标准兼容、主控简单,典型 7 位从机地址 0x68。
  • 实时时钟/日历寄存器:秒、分、时(12/24 小时格式可选)、星期、日期、月份、年份(两位数)并具备闰年补偿逻辑。
  • 56 字节电池备份 SRAM,可在主电源断电后保留用户数据。
  • 外置 32.768kHz 晶振输入(X1/X2),用于高精度计时。
  • 可编程方波输出(SQW/OUT),常见频率选择:1Hz、4.096kHz、8.192kHz、32.768kHz,便于系统时序或唤醒应用。
  • 低功耗设计:活动模式约 1.5mA,电池备份静态电流仅 300nA,延长纽扣电池使用寿命。
  • 封装:SOIC-8,便于通过孔或贴片电路板装配。

三 典型技术参数(基于给定基础参数)

  • 接口类型:I²C(双线,SDA、SCL)
  • 工作电压:4.5V ~ 5.5V
  • 工作电流(活动):约 1.5mA
  • 静态电流(电池备份 Iq):约 300nA
  • 晶振:外置 32.768kHz 石英晶体
  • 时钟寄存器:秒、分、时、星期、日期、月份、年(两位)
  • 电池备份 SRAM:56 字节
  • 方波输出:可编程,常见频率 1Hz/4.096kHz/8.192kHz/32.768kHz
  • 工作温度:0℃~+70℃
  • 封装:SOIC-8(8 引脚)
  • 常见引脚分布(SOIC-8):X1, X2, VBAT, GND, SCL, SDA, SQW/OUT, VCC(请以具体数据手册为准)

四 典型应用场景

  • 嵌入式控制器和单片机系统的实时时钟功能
  • 数据记录与数据采集设备(需要时间戳)
  • POS 机、收银终端与计费设备
  • 网络设备、路由器与通信终端(时间戳与事件记录)
  • 工业控制与监控系统(掉电事件记录)
  • 消费类电子产品(玩具、家用电器、智能家居等)需要低功耗时间保持的场合

五 设计与使用注意事项

  1. 晶体连接:DS1307 要求外接 32.768kHz 石英晶体,晶体必须直接连接到 X1/X2 引脚,线路尽量短且靠近芯片,避免寄生电容或强干扰源影响振荡稳定性。
  2. 电源与电池备份:在主电源 VCC 与备份电池 VBAT 切换时,确保按照器件手册正确接线。备份电源通常使用纽扣电池(如 CR2032),并在 PCB 布局时为电池留出安装位置与更换空间。
  3. I²C 总线:SDA、SCL 线需使用上拉电阻至 VCC(常见 2.2k~10k,取决于总线速度与负载)。注意总线电平与器件工作电压一致,避免电平不匹配。
  4. 方波输出与负载:SQW/OUT 输出能驱动小电流负载,如需驱动更大负载,请在外部增加缓冲器。
  5. 时钟精度与温度:实际计时精度受晶体特性与温度影响,如需高精度,请选用温补晶振或在软件中使用校准规则定期校正。
  6. 软件读写:通过标准 I²C 读写寄存器实现时间设置与读取,建议在读写寄存器时参照数据手册的寄存器映射与时序要求,避免跨字边界的并发访问导致的数据不一致。
  7. 封装与焊接:SOIC-8 封装适合标准 SMT 工艺,过热焊接可能影响芯片性能,参照厂家推荐的回流曲线进行焊接。

六 结语

DS1307Z+T&R 以其成熟稳定的 I²C 实时时钟功能、56 字节电池备份 SRAM 以及极低的电池待机电流,成为嵌入式系统中广泛采用的时间保持解决方案。设计时应注意晶振布局、电池备份与 I²C 信号完整性,以确保长期稳定工作。欲获得更详细的电气参数、时序图与寄存器描述,请参阅厂商原厂数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.