WMSIC Electronic Components

ADI/LINEAR MAX13035EETE+T MAX13035EETE

ModelMAX13035EETE+T
PackageTQFN-16-EP(4x4)
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR MAX13035EETE+T
Type
ADI/LINEAR
Minimum package
2500 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
MAX13035EETE+T
Electronic Component
1
Package
TQFN-16-EP(4x4)
Electronic Component
Converter / Level positions
Electronic Component
0.103g
Electronic Component
1
Electronic Component
1
Features
Output; Integrated Resistor
Electronic Component
BM0258755860
Operating Temperature
40℃~+85℃
Data
100Mbps
Type
Electronic Component
Operating Voltage(VCCA)
1.62V~3.2V
Operating Voltage(VCCB)
2.2V~3.6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX13035EETE+T 产品概述

一、产品简介

MAX13035EETE+T(厂商:ADI / Linear)是一款六通道双向电平转换器,专为不同电压域之间的逻辑信号接口设计。器件支持双电源工作,可在VCCA与VCCB两个电源域间实现可靠的电平传输和电平兼容,典型传播延时约6.5 ns,最高支持约100 Mbps的数据速率,适合高速数字接口的电平匹配与总线互通。

二、主要特性

  • 双向(双通道方向自动)电平转换,通道数:6(单片元件包含6路通道)。
  • 电源电压范围:VCCA = 1.62 V ~ 3.20 V;VCCB = 2.20 V ~ 3.60 V。
  • 数据速率:最高约100 Mbps,典型传播延时 ~6.5 ns。
  • 输出类型:支持开漏(适用于开漏总线如某些I2C实现)与推挽式信号驱动。
  • 工作温度范围:-40 ℃ ~ +85 ℃。
  • 封装:TQFN-16-EP (4×4 mm)。
  • 特性:电源去耦建议,便于抑制电源噪声并提高可靠性。

三、电气与环境参数

  • 器件为双供电设计,VCCA 与 VCCB 必须按规格供电以保证电平转换一致性与可靠性。
  • 在实际应用中,输出为开漏的通道通常需要外部上拉电阻到相应电源域;推挽输出通道可直接驱动负载(以器件数据手册为准)。
  • 推荐在VCCA、VCCB近端各放置适当值的陶瓷去耦电容(如0.1 µF~1.0 µF)以降低瞬态干扰。

四、典型应用场景

  • 不同电压域的MCU/FPGA与外设接口电平匹配(例如1.8 V ↔ 3.3 V)。
  • SPI、UART、GPIO、控制信号等总线的电平转换(使用前应确认总线驱动与时序特性)。
  • 多电源系统中各模块之间的互联、板级互操作设计。

五、PCB设计与使用建议

  • 电源去耦:VCCA、VCCB 端各自靠近器件引脚放置去耦电容,减小走线电感与寄生。
  • 上拉电阻:对开漏通道按总线速率和负载容量选择合适上拉电阻;速率高时减小阻值以提高上升沿。
  • 信号走线:高速信号尽量短且匹配阻抗,避免长走线引入反射与串扰。
  • ESD与保护:若工作环境有较强静电或浪涌,建议在输入端增加ESD保护器件或RC滤波以提高系统鲁棒性。

六、封装与采购提示

  • 封装型号:TQFN-16-EP(4 × 4 mm),便于高密度布板。
  • 选择与焊接:TQFN-EP 需注意焊盘设计与回流曲线,露热盘应接地或按厂商建议焊接以保证散热与电气性能。
  • 购买时请核对完整的器件型号(MAX13035EETE+T)、供应商与库存信息,并参考原厂数据手册以获取详细管脚、电气限值及典型应用电路。

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