Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DS18B20Z+T&R由亚德诺半导体(ADI)旗下LINEAR产品线推出,是一款针对宽温环境测温优化的数字温度传感器。其封装采用SOIC-8(小外形集成电路封装),符合表面贴装工艺要求,适配自动化贴装产线;产品后缀“T&R”表明采用编带包装,适合批量生产;“Z”标识工作温度范围为-55℃~+125℃,“+”代表符合RoHS环保标准(无铅无卤)。
引脚定义清晰:包含电源端(VDD)、接地端(GND)、单总线数据端(DQ),同时支持寄生电源模式(可通过DQ线供电,无需外部VDD),进一步简化电路设计,降低布线成本。
该传感器的核心优势在于可编程分辨率与单总线架构的结合,具体特性如下:
DS18B20Z+T&R采用单总线协议,仅需一根数据线(DQ)即可实现数据双向传输与供电(寄生电源模式),大幅减少系统布线复杂度,支持多个传感器在同一总线上组网(最多可挂接多个节点)。
通信过程分为三个阶段:
凭借宽温范围、单总线架构及低功耗特性,该传感器广泛应用于以下领域:
DS18B20Z+T&R的核心优势在于成本与性能的平衡:单总线减少布线成本,寄生电源模式无需额外电源电路,可编程分辨率适配不同场景,宽温范围覆盖工业级需求;ADI品牌保障可靠性与一致性,适合对成本敏感且需高可靠性的批量应用。相比同类单总线传感器,其精度与温度范围更具竞争力,尤其适合 harsh环境下的测温需求。
该产品凭借成熟的单总线技术与稳定的宽温性能,成为工业、汽车、智能家居等领域测温方案的主流选择。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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