Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ADI/LINEAR MAX490EESA+T MAX490EESA
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ADI(Analog Devices) / LINEAR MAX490EESA+T
- Type
- ADI/LINEAR
- Minimum package
- 2500
Technical parameters
- Electronic Component
- ADI(Analog Devices) / LINEAR
- Electronic Component
- MAX490EESA+T
- Electronic Component
- 1
- Package
- SOIC-Narrow-8
- Type
- Transceiver
- Electronic Component
- RS-485 / RS-422IC
- Electronic Component
- 0.219g
- Electronic Component
- 32
- Electronic Component
- 1
- Features
- Tx / Rx
- Electronic Component
- BM0258734434
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 4.75V~5.25V
- Receiver
- 1
- Data
- 2.5Mbps
- Communication
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MAX490EESA+T 产品概述
一、概述
MAX490EESA+T 是一款针对工业现场总线和差分串行通信设计的双向收发器，集成 1 个驱动器和 1 个接收器，支持 RS-422/RS-485 通信标准。器件工作电压范围为 4.75V～5.25V，典型数据速率可达 2.5Mbps，工作温度范围 -40℃～+85℃，并提供高达 ±15kV 的静电放电保护（HBM）。其低静态电流（典型 500µA）、限制上升/下降沿的斜率控制和 SOIC-Narrow-8 紧凑封装，使之非常适合对功耗、EMI 及 PCB 面积有严格要求的应用。
二、主要特性
- 单驱动器/单接收器配置，支持全双工通信（使用两对差分信号线即可实现）。
- 工作电压：4.75V～5.25V，兼容标准 5V 系统。
- 最大数据速率：2.5Mbps，满足高速现场总线需求。
- 复位及使能控制：独立的驱动使能（DE）与接收使能（RE）脚位，便于总线管理。
- 低静态电流：典型 500µA，适合对待机功耗敏感的系统。
- Slew-rate 限制：降低传输速率高频分量，减小 EMI 与反射噪声。
- ESD 保护：对外口提供 ±15kV HBM 级别防护，提高可靠性。
- 封装：SOIC-Narrow-8 占板面积小，易于集成。
三、典型应用场景
- 工业自动化与现场总线（PLC、遥测、I/O 模块）
- 楼宇自控与安防系统（门禁、楼宇对讲数据链路）
- 电机控制与伺服系统（长距离数字通信）
- 仪器仪表与数据采集系统
- 任何需在恶劣电磁环境下长距离差分通信的场合
四、设计与使用建议
- 电源去耦：在 VCC 引脚附近放置 0.1µF 陶瓷去耦电容，减小瞬态噪声。
- 终端匹配：在远端使用合适阻值（典型 100Ω～120Ω）的差分终端电阻以降低反射；根据传输线特性选择准确阻值。
- 总线空闲偏置：为保证无人驱动时总线稳定，建议在总线两端或集线器处添加拉高/拉低偏置电阻（阻值通常为几百欧至几千欧，根据系统总线拓扑与电源选择），以实现 fail-safe 功能。
- 布线与布局：差分对布线应成对并尽量保持走线长度一致，走线尽量靠近地平面，避免跨越大电流回路，DE/RE/DI/RO 与微控制器之间走线短且清晰。
- EMI 控制：器件自带 slew-rate 限制，有助于控制 EMI；如需进一步抑制可在差分线上并联小电容或在发送端串联 22Ω～33Ω 阻尼电阻。
五、封装与引脚概览
- 封装形式：SOIC-Narrow-8，适合自动贴装与工业级产品的装配流程。
- 常见引脚：A、B（差分收发对）；DI（驱动器输入）；RO（接收器输出）；DE（驱动器使能）；RE（接收器使能）；VCC（+5V）；GND（地）。使用时请参考厂商原始器件数据手册以获得准确引脚图与功能说明。
总结：MAX490EESA+T 在 5V 系统下提供了高速、低功耗且抗干扰能力强的差分收发能力，适用于工业与楼宇等苛刻环境中的长距离通信需求。建议在设计初期参考官方数据手册与参考电路，以确保终端匹配、偏置与走线满足系统可靠性与信号完整性要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
