WMSIC Electronic Components

ADI/LINEAR MAX13256ATB+T MAX13256ATB

ModelMAX13256ATB+T
PackageTDFN-10-EP(3x3)
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR MAX13256ATB+T
Type
TDFN-10-EP(3X3)
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
MAX13256ATB+T
Electronic Component
1
Package
TDFN-10-EP(3x3)
Electronic Component
Transformer Driver
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0264679031
Operating Temperature
40℃~+125℃
Operating Voltage
8V~36V
Power
800mA
Static Current(Iq)
650uA
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX13256ATB+T 产品概述

一、产品简介

MAX13256ATB+T 是 ADI/Linear 系列面向变压器驱动的高性能驱动器,适用于 8 V 至 36 V 宽输入电压范围的应用。器件集成了低静态电流的偏置电路与健全的保护功能(过温保护、过流保护、欠压锁定),在工业和汽车级供电环境下可实现稳定的变压器驱动控制。该器件以 TDFN-10-EP (3 mm × 3 mm) 小尺寸封装提供,便于在空间受限的电源与驱动板上实现高密度布置。

二、主要特性

  • 输入电压范围:8 V 至 36 V,覆盖常见 12 V、24 V 供电系统。
  • 驱动能力:功率管耐流能力标称 800 mA,适合驱动中小功率功率器件或变压器一级。
  • 静态电流 (Iq):典型 650 µA,适用于对待机耗电有要求的应用场景。
  • 工作温度:工业级 -40 ℃ 至 +125 ℃,满足严苛环境下长期可靠性要求。
  • 保护功能:集成过温保护 (OTP)、过流保护 (OCP) 与欠压锁定 (UVLO),提高系统安全性并简化外围保护电路设计。
  • 小封装:TDFN-10-EP (3×3 mm) 带导热外露铜垫,便于热管理与焊接工艺。

三、典型应用场景

  • 中小功率变压器供电的隔离式开关电源:如 12 V/24 V 到次级隔离电源的变换器驱动。
  • 工业电源模块:驱动高可靠性、低噪声的变压器级,适合控制器、电机驱动子系统的供电。
  • 汽车与车载电子:在 8 V–36 V 范围内兼容车载 12 V/24 V 网络,可用于车载隔离供电或传感器供电驱动(需满足车规认证要求)。
  • 电信与网络设备:用于局部隔离的辅助电源与驱动模块。

四、电气与热特性要点

  • 宽输入电压提升了系统对输入波动与瞬变的容忍度,但在接近上限电压时要注意功耗与器件应力。
  • 800 mA 的功率管耐流能力使得在驱动切换瞬态中能承受较大的峰值电流,但应根据实际拓扑(如反激、半桥)评估平均与峰值应力,合理选型功率器件与散热方案。
  • 650 µA 的低静态电流有利于系统待机能耗控制,但在高频切换和高负载工况下,要关注动态损耗与开关损耗的管理。
  • TDFN-10-EP 的外露铜垫需与 PCB 大面积铜箔以及多孔热通孔配合使用,以维持器件在高环境温度与高损耗工况下的热稳定性。

五、封装与布局建议

  • 推荐将外露散热焊盘(EP)焊接至 PCB,并下方布置若干热过孔(thermal vias)与大面积散热铜箔,以降低结温并提高热循环寿命。
  • 输入电源端靠近器件放置低 ESR 解耦电容,输入端短且粗的走线可降低寄生电感,减小开关尖峰与 EMI。
  • 驱动路径尽量缩短,功率器件和变压器的初级回路亦应靠近,减少回流环路面积和辐射干扰。
  • 保护与监测信号线应远离高 dv/dt 区域,必要时增加 RC 滤波或共模抑制措施。

六、设计注意事项与建议

  • 在系统设计阶段应对过流保护限值、延时与再次起动策略做出明确定义,以避免误动作或对负载造成伤害。
  • 欠压锁定(UVLO)门槛应与系统上电序列匹配,确保在供电不稳时驱动器处于受控状态。
  • 过温保护触发策略需要结合 PCB 散热能力与环境温度边界进行验证,建议在典型与极端工况下做热仿真与实测。
  • 选择配套的功率管与磁性器件时,要综合考虑峰值电流、结温升、杂散电容与布局引起的寄生,必要时加入阻尼或吸收网络降低振铃与能量回灌。

总结:MAX13256ATB+T 为面向 8 V–36 V 输入的紧凑型变压器驱动解决方案,低静态电流与完善的保护功能使其在工业、车载及嵌入式电源应用中表现出良好的实用性。合理的 PCB 热管理与布局设计能充分发挥其性能,满足高可靠性电源系统的设计需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.