WMSIC Electronic Components

ADI/LINEAR LT8609AEMSE#TRPBF LT8609AEMSE

ModelLT8609AEMSE#TRPBF
PackageMSOP-10-EP
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR LT8609AEMSE#TRPBF
Type
ADI/LINEAR
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
LT8609AEMSE#TRPBF
Electronic Component
1
Package
MSOP-10-EP
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.1g
Electronic Component
1
Features
Frequency Synchronous;; EMI Optimization; Output Voltage
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0264679030
Operating Temperature
40℃~+125℃
Operating Voltage
3V~42V
Switching Frequency
200kHz~2.2MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LT8609AEMSE#TRPBF 同步降压DC-DC电源芯片产品概述

LT8609AEMSE#TRPBF是亚德诺半导体(ADI)旗下LINEAR系列的同步降压型DC-DC电源芯片,针对宽电压输入、低功耗、高效能及 harsh环境应用优化,具备内置开关管、可调输出、工业级温度范围等核心特性,广泛适配电池供电、工业控制、汽车电子等场景。

一、核心拓扑与整流设计

该芯片采用降压式拓扑结构,核心为同步整流方案(内置功率开关管),无需外部续流二极管,可简化外围电路设计并提升转换效率。输出通道为1路,输出电压可通过外部电阻网络灵活调节(范围782mV~42V),适配从低功耗传感器到中等功率负载的多种电压需求。内置开关管进一步减少外部元件数量,降低设计复杂度与成本。

二、宽电压输入输出能力

芯片支持3V~42V宽输入电压范围,覆盖常见电源场景:包括单节/多节锂电池(3.7V16.8V)、12V/24V工业电源、甚至42V高压供电系统;输出电压范围为**782mV42V**,可精准设置为5V、3.3V、12V等常用电压,最大输出电流达3A,满足微处理器、无线通信模块、电机驱动等中等功率负载的供电需求。

三、高效能与低静态电流特性

同步整流设计使转换效率最高可达90%以上(典型工况),减少热损耗;静态电流仅1.7uA(典型值),是同类产品中较低水平,可显著降低电池供电设备的待机功耗,延长电池续航时间。开关频率支持200kHz~2.2MHz宽范围,工程师可根据设计需求选择:高频(如2MHz)可缩小电感、电容等外围元件体积,适合小型化设计;低频(如200kHz)则可提升效率,适配大功率输出场景。

四、宽温与封装适应性

芯片工作温度范围为**-40℃~+125℃,符合工业级温度标准,可稳定运行于极端环境(如汽车发动机舱、户外工业设备)。采用MSOP-10-EP封装**(10引脚增强型小外形封装,带暴露焊盘),体积小巧(约3mm×3mm),适合高密度PCB设计;暴露焊盘可增强散热性能,避免芯片因过热降额,保障长期可靠性。

五、典型应用场景

基于上述特性,LT8609AEMSE#TRPBF适用于多种场景:

  1. 电池供电设备:如便携式医疗仪器、手持终端,低静态电流延长待机时间;
  2. 工业控制模块:如PLC、传感器节点,宽温宽压适配工业现场电源波动;
  3. 汽车电子:如车载显示屏、辅助驾驶模块,-40℃~+125℃满足车规温度要求;
  4. 物联网(IoT)节点:如智能传感器、无线网关,小封装与低功耗适配低功耗设计;
  5. 消费电子:如移动电源、智能音箱,高效能提升续航与散热表现。

LT8609AEMSE#TRPBF通过宽电压范围、低静态电流、高效同步整流、工业级温度及小封装的平衡设计,为不同领域的电源设计提供了高性价比的解决方案,适合对体积、功耗、可靠性有严格要求的应用场景。

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