WMSIC Electronic Components

ADI/LINEAR MAX16025TE+T MAX16025TE

ModelMAX16025TE+T
PackageQFN-16-EP(4x4)
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR MAX16025TE+T
Type
ADI/LINEAR
Minimum package
2500 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
MAX16025TE+T
Electronic Component
1
Package
QFN-16-EP(4x4)
Electronic Component
Supervisorand positions IC
Electronic Component
0.26g
Electronic Component
1
Features
positions
Electronic Component
BM0228147300
Reset
140ms
Operating Temperature
40℃~+125℃@(TA)
Operating Voltage
2.2V~28V
ICType
Voltage Supervisor
Output Type
Electronic Component
Static Current(Iq)
75uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX16025TE+T 产品概述

一、功能概述

MAX16025TE+T 是一款高可靠性的电压监控器芯片,来自 ADI/Linear(亚德诺/线性)产品系列。器件提供低功耗的电源监控与复位控制功能,采用开漏(Open‑Drain)复位输出,复位为低电平有效,并带有手动复位输入,适合对系统上电排序、欠压检测与看门狗式复位管理的应用。

二、主要参数亮点

  • 工作电压:宽范围 2.2V ~ 28V,适配从单电池到工业总线供电等多种场景。
  • 受监控电压通道:本型号针对两路电压监控(Dual),同时系列中亦有 Triple/Quad 等多通道变体,便于系统选择。
  • 静态电流(Iq):典型值 75 μA,满足低功耗系统对待机电流的严格要求。
  • 复位超时:140 ms(典型),保证电源稳定后给予充足的复位拉高延时。
  • 复位输出类型:开漏结构,低电平有效,可与外部上拉电阻连入不同逻辑电平,支持多器件线与(wired‑OR)连接。
  • 工作温度:-40 ℃ ~ +125 ℃ (TA),适用于工业级与车规附近温度要求的应用。
  • 封装:QFN‑16‑EP (4×4),利于散热与 PCB 布局密度控制。

三、功能与行为描述

芯片在任一受监控通道发生欠压时拉低复位输出,复位为低有效态;当所有监控电压恢复到合格水平并稳定后,器件按内部超时周期(约 140 ms)释放复位,以避免短暂电压抖动导致的误复位。手动复位引脚允许外部按键或微控制器触发强制复位,适用于软件异常或现场故障恢复。

四、典型应用场景

  • MCU/FPGA/ASIC 的上电监控与复位管理;
  • 多轨电源系统的电源序列控制与缺省保护;
  • 工业控制、通讯设备及车载电子(在规定温度范围内);
  • 存储子系统、RTC 及外设电源完整性保障。

五、PCB 与设计建议

  • 由于复位输出为开漏,请在系统侧使用合适阻值的上拉电阻将复位线拉至所需逻辑电平;若需多器件共享复位线,可利用该开漏特性实现线与连接。
  • 推荐在芯片电源引脚附近放置去耦电容,抑制瞬态干扰,提升监测稳定性。
  • 手动复位引脚在不使用时应按数据手册建议处理(通常拉高或连接至合适电平),以避免浮空导致误动作。
  • QFN‑16‑EP 封装需注意焊盘设计与散热通孔,以保证良好的热性能与焊接一致性。

六、选型与替代

MAX16025TE+T 属于 ADI/Linear 系列电压监控器,若系统有更多通道或不同阈值/超时时间的需求,可在同一产品家族中查找 Triple/Quad 或阈值不同的变体以匹配设计要求。选型时请参考官方数据手册以获得完整电气特性、引脚定义与时序图。

以上信息基于产品关键参数与典型应用总结,建议在最终设计与采购前参照 ADI 官方数据手册与样品验证具体性能与引脚配置。

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