WMSIC Electronic Components

ADI/LINEAR AD8055ARTZ-REEL7 AD8055ARTZ

ModelAD8055ARTZ-REEL7
PackageSOT-23-5
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR AD8055ARTZ-REEL7
Type
ADI/LINEAR
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
AD8055ARTZ-REEL7
Electronic Component
1
Package
SOT-23-5
Electronic Component
Operational Amplifier
Electronic Component
0.058g
Electronic Component
1
Features
ESD
Electronic Component
BM0264755673
Operating Temperature
40℃~+85℃
Amplifier
1
Output Current
60mA
(SR)
1.4V/ns
Static Current(Iq)
6.5mA
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AD8055ARTZ-REEL7 产品概述

AD8055ARTZ-REEL7 是 ADI/Linear 家族中一款高性能电压反馈放大器,单通道封装于 SOT-23-5 封装中,适合空间受限且对带宽、噪声与线性度有一定要求的便携和工业类应用。该器件在保持低功耗的同时,提供较高的增益带宽积和较好的噪声性能,适合宽带信号调理、缓冲和驱动 ADC/ADC 前端等场合。

一、主要性能亮点

  • 放大器通道数:1 通道
  • 最大电源电压差(Vdd–Vss):12 V
  • 常用工作供电:单电源 4 V~6 V,或对称双电源 ±4 V~±6 V(注意总差值不超过 12 V)
  • 增益带宽积(GBW):300 MHz,适合宽带增益配置
  • 压摆率(SR):1.4 V/ns,限制作大幅度快速边沿时的失真
  • 输入失调电压(Vos):5 mV(典型/上限视具体批次),温漂(Vos TC):6 μV/℃,具有较稳定的直流精度
  • 输入偏置电流(Ib):1.2 μA,需要注意与高阻源的搭配
  • 输入电压噪声密度(eN):6 nV/√Hz @ 100 kHz,低噪声特性利于信号保真
  • 共模抑制比(CMRR):82 dB,对共模干扰有较好抑制能力
  • 静态工作电流(Iq):6.5 mA,功耗适中
  • 输出驱动能力:输出电流可达 60 mA,能驱动一定负载
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 功能特性:器件带有 ESD 保护
  • 封装:SOT-23-5,适合自动化贴装与小体积应用

二、关键参数解读

  • 带宽与增益:300 MHz 的 GBW 意味着在低增益(例如增益 +1 或 +2)配置下可获得很宽的通带,适用于视频或高速信号路径;在高增益配置下带宽将按 GBW 规律衰减。
  • 压摆率与大信号性能:1.4 V/ns 的压摆率对中等幅值、高速信号有一定限制,若需处理大振幅的高频快速边沿,应评估压摆率导致的失真与速率限制。
  • 噪声与精度:6 nV/√Hz 的电压噪声密度在 100 kHz 处表现良好,结合 5 mV 的失调,适合低噪声放大器或 ADC 前端使用,但对极高精度直流测量仍需外部校正。
  • 偏置电流影响:1.2 μA 的偏置电流在与高阻抗源(例如电容耦合的传感器或高阻传感器)配合时,会引入偏置电压,建议采用合理的输入阻抗设计或加偏置补偿。

三、典型应用场景

  • ADC 驱动与缓冲:为高速 SAR 或 ADC 提供带宽与低噪声前端。
  • 视频/宽带放大:用于视频处理线路或通讯前端的缓冲与放大。
  • 信号整形与隔离:作为电压跟随器、增益块或滤波器的构成单元。
  • 便携测量与工业控制:受限空间内的宽带放大解决方案。
  • 仪器仪表与数据采集系统。

四、封装与热、布局注意

  • 封装为 SOT-23-5,体积小、利于高密度布板,但散热能力有限,长时间大电流工作或高温环境下需注意功耗管理与热沉设计。
  • PCB 布局建议:紧凑的电源去耦(靠近 Vcc/Vee 引脚放置 100 nF 陶瓷电容,另并联 1 μF 以抑制低频噪声),输入与反馈路径尽量短,接地回路面积最小化,以降低噪声与振铃。输出驱动大电容负载时注意稳定性。

五、设计与使用建议

  • 供电选择:确保总电源差不超过 12 V;若选择单电源或对称双电源,务必做好电源滤波与去耦。
  • 增益配置与补偿:作为电压反馈放大器,闭环增益越高带宽越窄。设计时估算闭环带宽与相位裕度,必要时在反馈网络中加入适当的补偿元件以保证稳定性。
  • 噪声与偏置管理:对低噪系统,优先使用低阻抗源与低噪元件,限制输入阻抗以减小偏置电流造成的失真。
  • ESD 与保护:尽管器件带 ESD 保护,现场使用仍建议在输入/输出端加入防护元件以防极端浪涌。

六、订购与包装信息

  • 型号:AD8055ARTZ-REEL7
  • 品牌:ADI(Analog Devices)/ Linear
  • 封装:SOT-23-5
  • 出货形式:卷带(REEL),适合 SMT 自动贴装。具体最小订购量与交期请咨询正规代理或 ADI 销售渠道。

如需针对具体电路(例如驱动 50 Ω 负载、与 ADC 匹配的差分前端或滤波器设计)的参考电路和布局示意,可提供目标增益、负载与带宽需求,我将给出更细化的设计建议与仿真要点。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.