WMSIC Electronic Components

ADI/LINEAR MAX9768BETG+T MAX9768BETG

ModelMAX9768BETG+T
PackageTQFN-24(4x4)
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR MAX9768BETG+T
Type
TQFN-24(4X4)
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
MAX9768BETG+T
Electronic Component
1
Package
TQFN-24(4x4)
Electronic Component
87%
Electronic Component
Audio Power Amplifier
Electronic Component
0.42g
Electronic Component
97dB
Electronic Component
1
Power Amplifier Type
D Power Amplifier
Features
Filter;; Analog Voltage; /; / Switch
Electronic Component
BM0264585667
Operating Temperature
40℃~+85℃
Operating Voltage
4.5V~14V
Output Power
10Wx1@8Ω

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX9768BETG+T 产品概述

一、概述

MAX9768BETG+T 是一款单声道 D 类音频功率放大器,采用无滤波器(filterless)架构,封装为 TQFN-24(4×4mm)。器件工作电压范围宽(4.5V–14V),在 8Ω 负载下可提供 10W 输出功率,效率高达 87%,非常适合便携式、多媒体和车载等对功耗和尺寸敏感的音频应用。

二、主要性能指标

  • 输出功率:10 W x1 @ 8Ω
  • 总谐波失真+噪声(THD+N):0.08%
  • 静态电流(Iq):14.2 mA
  • 信噪比(SNR):97 dB
  • 电源纹波抑制比(PSRR):77 dB
  • 工作温度:-40℃ 到 +85℃

三、功能特性

  • 无滤波器架构,省去外部输出 LC 滤波器,简化 BOM 与板级设计
  • 数字编程增益,便于系统级软件或硬件配置增益档位
  • 模拟电压增益支持前端灵活匹配
  • 使能/关断端口(EN)与自动静音/免噪声开关(mute/no-pop)功能,提升用户体验并降低开机弹音
  • 低静态电流,适合待机与节能场景

四、典型应用场景

  • 便携式蓝牙音箱与智能音箱
  • 车载信息娱乐与扬声器驱动(单声道或桥接)
  • 平板及便携多媒体终端
  • 专业音频前端放大模块

五、封装与系统集成建议

器件以 TQFN-24(4×4mm)形式提供,适合高密度 PCB 布局。关键设计要点包括:

  • 在电源引脚附近放置低 ESR 去耦电容(如 10µF 与 0.1µF 并联)以抑制电源噪声并提高 PSRR 表现
  • 输出为无滤波器架构,扬声器可直接连接,但注意 PCB 铜箔与过孔设计以降低寄生阻抗与 EMI
  • 为 mute/EN 引脚增加 RC 去抖或上拉/下拉电阻以保证上电行为可控
  • 留足散热铜箔面积(底部 exposed pad)以保证在高功率输出下器件温升受控

六、系统级注意事项

  • 当系统工作电压接近上限时,功率和热耗显著上升,需验证热稳定性与热保护
  • 无滤波器设计对 PCB 布线和接地要求更高,避免长回路和耦合到敏感模拟电路
  • 数字编程增益需在系统固件中合理配置,避免突变导致扬声器损伤或主观失真

七、总结

MAX9768BETG+T 以其高效率、低待机电流、优秀的 SNR 与 PSRR 及无滤波器架构,为空间受限且对能耗、音质有要求的音频应用提供了简洁且可靠的功放解决方案。合理的 PCB 布局、去耦与热管理能充分发挥其性能并提高整机稳定性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.