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ADI/LINEAR MAX31856MUD+T MAX31856MUD
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ADI(Analog Devices) / LINEAR MAX31856MUD+T
- Type
- ADI/LINEAR
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ADI(Analog Devices) / LINEAR
- Electronic Component
- MAX31856MUD+T
- Electronic Component
- 1
- Package
- TSSOP-14
- Electronic Component
- ADC / DAC - Special Purpose
- Electronic Component
- 0.12g
- Electronic Component
- 1
- Features
- Programmable; Built-in Temperature Sensor
- Electronic Component
- BM0257647295
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 3V~3.6V
- Interface Type
- SPI
- ICType
- Converter
- Static Current
- 10uA
- Resolution (bit)
- 19
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MAX31856MUD+T 产品概述
一、概述
MAX31856MUD+T 是一款面向热电偶温度测量的数字转换器，提供高分辨率、低功耗的信号调理与数模转换功能。器件工作电压在 3.0V 至 3.6V 之间，内置参考电压（0.735V），通过标准 SPI 接口输出数字化温度数据，适合工业与便携式测温系统使用。品牌归属 ADI/LINEAR，封装为 TSSOP-14，便于 PCB 布局与量产装配。
二、主要规格
- 分辨率：19-bit（高分辨率，可获得精细温度分辨率）
- 工作电压：3.0V ~ 3.6V
- 接口类型：SPI（兼容主流微控制器）
- 工作温度范围：-40℃ ~ +125℃
- 基准电压源：内置，基准电压值 0.735V
- 静态电流：10 μA（低功耗待机）
- 工作电流说明：描述中标注在 3.6V 供电下典型工作电流约 1.2 mA
- 封装：TSSOP-14（运输卷带：T/R）
三、关键特性与优势
- 高分辨率：19-bit 分辨率有利于精细的温度测量与微小温差检测。
- 低功耗：10 μA 的静态电流降低待机能耗，适合电池供电或能耗受限的系统。
- 内置参考：0.735V 内置基准简化外部参考设计，提高系统稳定性。
- 标准 SPI：SPI 接口实现高速、可靠的数据传输与寄存器访问，易于与 MCU/FPGA 集成。
- 宽温范围：器件本身在工业级温度范围内可靠工作，适合多数工业环境。
四、典型应用场景
- 工业过程温控与监测（炉温、管道、反应釜等）
- HVAC 与能源设备温度采集
- 医疗与实验室温度记录仪器（配合合适的传感头）
- 便携式温度校准及数据记录设备
- 嵌入式传感节点与物联网终端温度采集
五、封装与系统集成建议
TSSOP-14 封装利于中密度 PCB 布局。建议在热电偶输入与器件之间做好信号完整性与地线隔离，短、粗的接地回路能减少噪声耦合。为保证基准稳定与测量精度，PCB 上需为基准器件和模拟信号留出合理的净空区，并在电源入口处加滤波与去耦电容。
六、使用注意事项
- 工作电压应保持在 3.0V 到 3.6V，避免长时间超出规格以保证可靠性。
- 虽然器件支持宽温度范围，但热电偶接线与环境热源分布会影响测量精度，应做热隔离与屏蔽。
- SPI 时序、输入滤波和冷端补偿策略需在上位固件中合理设计，以获得稳定而准确的温度读数。
总结：MAX31856MUD+T 以其高分辨率、低静态功耗和内置参考的特点，适用于工业级和便携式热电偶测温系统。合理的电路设计与 PCB 布局能充分发挥其测量性能与稳定性。
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