WMSIC Electronic Components

ADI/LINEAR ADA4927-1YCPZ-R7 ADA4927

ModelADA4927-1YCPZ-R7
PackageLFCSP-16
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR ADA4927-1YCPZ-R7
Type
ADI/LINEAR
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
ADA4927-1YCPZ-R7
Electronic Component
1
Package
LFCSP-16
Electronic Component
Differential Op Amp
Electronic Component
0.07g
Electronic Component
1
Features
Output Common Mode Voltage; /; Single-Ended Conversion; Integrated ADCDriver
Electronic Component
BM0264685419
Operating Temperature
40℃~+105℃
Amplifier
Electronic Component
Electronic Component
10ns
Output Current
50mA
Output Type
Electronic Component
(SR)
5000V/us

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ADA4927-1YCPZ-R7 高速差分电流反馈放大器产品概述

ADA4927-1YCPZ-R7是亚德诺半导体(ADI)旗下LINEAR系列的单路高速差分电流反馈放大器,针对高频、高速信号调理场景优化,以紧凑LFCSP-16(3×3mm)封装实现高性能与高密度设计的平衡,广泛适配通信、测试测量、工业传感等领域的高速信号链路需求。

一、核心定位与封装特性

该器件为单路差分电流反馈放大器,采用LFCSP-16超小型封装(尺寸仅3×3mm),大幅降低PCB占用面积,适合对空间敏感的高密度系统(如便携式测试仪器、射频模块)。相比传统电压反馈放大器,电流反馈架构无需反馈电容补偿,在宽频带、高增益场景下无带宽压缩问题,天然适配高速信号放大需求。

二、关键性能参数亮点

ADA4927-1YCPZ-R7的性能围绕“高速、低噪声、抗干扰”三大核心优化,关键指标及价值如下:

  • 高速响应能力:增益带宽积(GBP)达2.3GHz,压摆率(SR)高达5000V/μs,稳定时间仅10ns(1V阶跃信号),可完美处理100MSPS以上ADC输入、高频脉冲信号;
  • 低噪声设计:100kHz处噪声密度低至1.4nV/√Hz,在微弱传感器信号、高速图像传感器信号调理中,可有效保留信号细节;
  • 强抗干扰性:共模抑制比(CMRR)93dB,电源纹波抑制比(PSRR)89dB,能抑制系统共模噪声与电源纹波,提升信号链路信噪比;
  • 直流精度与驱动能力:输入失调电压(Vos)300μV、温漂1.5μV/℃;输入偏置电流500nA、失调电流0.6μA;输出电流可达50mA,可直接驱动50Ω传输线、ADC输入,无需额外缓冲级。

三、适配场景与应用价值

该器件的高速差分特性使其成为多领域核心器件:

  • 高速数据采集:作为12~16位高速ADC(如1GSPS级)前端驱动,差分输出与ADC输入完美匹配,提升采集精度与速度;
  • 通信系统:用于射频中频(IF)放大、光纤通信光探测器信号调理,2.3GHz带宽覆盖L/S频段中频(1GHz左右),适配5G、宽带通信;
  • 测试测量仪器:示波器探头放大、脉冲信号发生器缓冲、高速逻辑分析仪输入调理,10ns稳定时间可快速响应快速脉冲;
  • 工业高速传感:高速相机图像信号放大、激光测距仪脉冲调理,工业级温度范围(-40℃~+105℃)适配现场恶劣环境。

四、电源与环境兼容性

  • 灵活电源:支持单电源(4.5V11V)与双电源(-5V5V,Vdd-Vss最大10V)供电,静态电流仅20mA,兼顾性能与功耗;
  • 宽温工作:-40℃~+105℃工业级温度范围,可在车载、户外基站等极端场景稳定运行;
  • 差分输出优势:输出为差分信号,抑制共模噪声,适合长距离传输(如50Ω同轴电缆)。

五、设计优势与可靠性

作为ADI成熟产品,ADA4927-1YCPZ-R7具备:

  • 高密度集成:3×3mm封装减少PCB布线复杂度,提升系统集成度;
  • 性能功耗平衡:2.3GHz带宽下仅20mA静态电流,适合电池供电或低功耗系统;
  • 高可靠性:采用ADI BiCMOS工艺,参数一致性好,长期稳定性强,适配量产需求。

综上,ADA4927-1YCPZ-R7以高速差分电流反馈架构为核心,结合小封装、低噪声、强抗干扰与工业级特性,是当前高速信号调理领域的高性价比选择,可有效解决通信、测试测量、工业传感等场景的高速信号放大需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.