WMSIC Electronic Components

ADI/LINEAR MAX15062AATA+T MAX15062AATA

ModelMAX15062AATA+T
PackageDFN-8(2x2)
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR MAX15062AATA+T
Type
ADI/LINEAR
Minimum package
2500 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
MAX15062AATA+T
Electronic Component
1
Package
DFN-8(2x2)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.071g
Electronic Component
1
Features
Built-in LDORegulator
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0258810008
Operating Temperature
40℃~+125℃@(TA)
Operating Voltage
4.5V~60V
Switching Frequency
465kHz~535kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX15062AATA+T 产品概述

一、产品概况

MAX15062AATA+T 是一款降压型开关稳压器,面向宽电压输入和受限空间应用。器件为固定输出3.3V、单路输出、同步整流降压拓扑,内部集成开关管,能够在4.5V至60V的输入范围内稳定工作,最大输出电流可达300mA。开关频率位于465kHz~535kHz之间,工作温度范围为-40℃至+125℃(TA)。器件采用小型DFN-8 (2×2 mm) 封装,适合对体积和散热有要求的便携或工业设备。

二、主要特点

  • 宽输入电压范围:4.5V ~ 60V,适应车载、工业和高压来源场景。
  • 固定输出:3.3V,便于快速选型与系统集成。
  • 输出能力:最大300mA,满足多数低功耗模块与外围电路供电需求。
  • 同步整流:降低整流损耗、提高效率,尤其在中高电流下优势明显。
  • 中等开关频率(≈500kHz):有利于减小外部电感与电容体积,同时需注意电磁兼容(EMC)和布局。
  • 宽温范围:-40℃ ~ +125℃,可靠性适用于恶劣环境。
  • 小体积封装:DFN-8 (2×2) 便于节省PCB空间,但需良好散热设计。

三、典型应用

  • 汽车电子的3.3V辅助电源(车载电源拓扑中,输入可能为12V或更高瞬态)。
  • 工业自动化设备、仪器的局部降压。
  • 通信与控制模块、传感器供电。
  • 便携式设备和嵌入式系统需要高输入耐受性的场合。

四、设计要点与布局建议

  • 输入端建议采用低ESR陶瓷电容以抑制开关噪声和高频纹波;对高频瞬态可并联大容量电解/钽电容以改善中低频特性。
  • 输出滤波器选择低DCR、磁芯损耗低的片式电感,额定电流需高于负载峰值,避免磁饱和。
  • 同步整流器虽降低整流损耗,但在轻载或停机状态可能产生回输问题,建议参考器件资料对软启动、使能与保护功能进行配置。
  • 布局注意:尽量缩短开关结点(开关管、二极管/同步MOS管、输出电感、输入电容)环路,保证大电流回路面积最小化;将敏感信号(反馈、补偿)远离开关节点以降低噪声干扰。
  • EMI控制:采取输入滤波、合理走线、地平面完整和必要的屏蔽或共模抑制措施,有助于满足电磁兼容要求。

五、封装与热管理

DFN-8 (2×2 mm) 封装体积小,热阻相对较高,需在PCB上配合大面积的散热铜箔和过孔热通道来提升热传导能力。器件在高输入电压且高负载条件下会产生较大功耗,应在原理图与布局阶段预留足够散热裕度,必要时评估降额使用或增加散热路径。

六、选型与使用注意事项

  • 在选择此器件时,请评估系统最大输入电压瞬态、负载最大电流及环境温度,保证器件工作在安全区间内。
  • 关注启动与欠压、过流、过温保护等系统级需求,结合外部电路实现可靠性设计。
  • 在空间受限但需耐高压输入的应用场合,MAX15062AATA+T 提供了较优的集成度与性能平衡;若系统对更高电流或更高效率有要求,可考虑并行或选用更大功率级别的器件。

总结:MAX15062AATA+T 以其宽输入、同步整流和小型封装特性,适合在汽车与工业等需要高输入耐受性和紧凑布局的应用中作为3.3V、300mA的可靠降压解决方案。设计时重点在于合理选择外部滤波元件、优化PCB热与布局以确保稳定、高效运行。

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