Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ADI/LINEAR AD8510ARZ-REEL7 AD8510ARZ
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ADI(Analog Devices) / LINEAR AD8510ARZ-REEL7
- Type
- ADI/LINEAR
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ADI(Analog Devices) / LINEAR
- Electronic Component
- AD8510ARZ-REEL7
- Electronic Component
- 1
- Package
- SOIC-8
- Electronic Component
- FET-Input Op Amp
- Electronic Component
- 0.15g
- Electronic Component
- 1
- Features
- Load Driver; Built-in
- Electronic Component
- BM0258885335
- Operating Temperature
- 40℃~+125℃
- Amplifier
- Electronic Component
- Output Current
- 54mA
- (SR)
- 20V/us
- Static Current(Iq)
- 2.5mA
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AD8510ARZ-REEL7 产品概述
一、概述
AD8510ARZ-REEL7 是 Analog Devices / Linear 推出的单路 FET 输入运算放大器，面向对低偏置电流、高速摆率和低噪声有要求的模拟前端应用。器件在宽温度范围内稳定工作，适用于精密信号调理、传感器接口及数据采集等场景。封装为 SOIC-8，卷盘包装（REEL7）便于贴片生产与大批量装配。
二、主要特点
- 单路 FET 输入结构，典型输入偏置电流 25 pA，适合高阻抗源驱动。
- 增益带宽积（GBP）8 MHz，压摆率（SR）20 V/µs，兼顾带宽与瞬态性能。
- 输入失调电压 (Vos) 约 900 µV，温漂仅 5 µV/℃，便于精密增益设置。
- 共模抑制比（CMRR）高达 108 dB，差模性能优异。
- 静态电流 Iq 2.5 mA，输出电流能力可达 54 mA。
- 噪声密度 eN ≈ 8 nV/√Hz @1 kHz，低噪声等级适合微小信号放大。
- 工作温度范围 -40 ℃ 至 +125 ℃，最大供电电压差 30 V；支持双电源 ±5V～±15V 或单电源 5V～15V。
三、典型应用
- 精密传感器信号调理（热电偶、应变片、电化学传感器等）
- 数据采集前端与仪表放大器驱动
- 主动滤波与积分/微分电路
- 低功耗便携式设备和工业控制接口
四、电气参数要点（便于快速选型）
- 放大器数：单路
- GBP：8 MHz
- 输入偏置电流 Ib：25 pA
- 输入失调电压 Vos：900 µV（典型）
- Vos 温漂：5 µV/℃
- CMRR：108 dB
- 压摆率 SR：20 V/µs
- 静态电流 Iq：2.5 mA
- 输出电流：54 mA
- 噪声密度：8 nV/√Hz @1 kHz
- 工作温度：-40 ℃ ~ +125 ℃
- 电源：双电源 -15V ~ -5V 或 5V ~ 15V，最大电源宽度 30V
五、封装与订购信息
- 型号：AD8510ARZ-REEL7
- 品牌：ADI / Linear
- 封装：SOIC-8，卷盘（REEL7）包装，适合贴片生产与自动化装配。
- 建议在采购时确认批号、交期及是否为工业级温度范围。
六、使用建议与注意事项
- 对于高阻抗源，请保证输入引脚附近良好隔离与低漏电路径，避免焊剂或指纹带来额外偏置电流。
- 电源旁路必须充分，建议在近引脚处放置 0.1 µF 与 10 µF 的并联电容以抑制瞬态和振铃。
- 在苛刻的低噪声应用中，注意布局与接地，信号线尽量短并使用屏蔽或缓冲。
- 由于 GBP 与 SR 有限，放大倍数较高时应关注闭环稳定性与相位裕量，必要时加入补偿网络。
如需进一步的电气特性曲线、典型应用电路或 PCB 布局参考，可参阅 ADI 官方数据手册或联系器件供应商获取原厂应用说明。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
