WMSIC Electronic Components

ADI/LINEAR MAX1759EUB+T MAX1759EUB

ModelMAX1759EUB+T
PackageMSOP-10
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR MAX1759EUB+T
Type
ADI/LINEAR
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
MAX1759EUB+T
Electronic Component
1
Package
MSOP-10
Electronic Component
Charge Pump
Electronic Component
0.253g
Electronic Component
1
Features
Load; /; Output; Low Power
Type
Electronic Component
Electronic Component
BM0264802196
Operating Temperature
40℃~+85℃
Operating Voltage
1.6V~5.5V
Switching Frequency
1.5MHz
Electronic Component
90%
Static Current(Iq)
180uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX1759EUB+T 产品概述

一、产品简介

MAX1759EUB+T是一款专为低电压供电系统设计的升降压(buck/boost)稳压电荷泵解决方案,输入电压范围1.6V~5.5V,可稳定输出3.3V、最大输出电流100mA。器件具有极低静态电流(Iq≈180µA)和高转换效率(可达90%),工作开关频率约1.5MHz,适合对尺寸、效率和待机功耗有严格要求的便携式与电池供电设备。

二、主要技术参数

  • 功能类型:升降压(buck/boost)电荷泵
  • 工作电压:1.6V ~ 5.5V
  • 输出电压:3.3V(固定输出)
  • 额定输出电流:100mA
  • 静态电流(Iq):约180µA
  • 能量效率:典型值可达90%
  • 开关频率:1.5MHz(典型)
  • 工作温度范围:-40℃ ~ +85℃
  • 封装:μMAX/MSOP-10(业内超小尺寸的100mA方案)

三、功能特性亮点

  • 软启动:上电与启动过程受控,限制浪涌电流并降低对上游电源的冲击。
  • 负载断开:可在空载或待机模式下切断输出,进一步降低系统功耗。
  • 倍压/反相拓扑切换:内置拓扑切换机制,支持在不同输入条件下选择最优转换方式,保证稳定输出。
  • 输出短路保护:提供过流/短路保护以提高系统可靠性。
  • 低功耗待机:待机模式下静态电流极低,延长电池续航。

四、典型应用场景

  • 便携式手持设备与传感器节点,需要在单节电池或变动输入下输出稳定3.3V。
  • 工业或消费类低功耗控制模块与MCU供电。
  • 通信模块、蓝牙/无线外设以及需要体积受限的嵌入式系统。
  • 需要冷启动与空载断电保护的电源管理模块。

五、设计与使用建议

  • 外围电容:建议使用低ESR陶瓷电容以降低纹波并保证稳定性;注意布局上输入与输出电容尽量靠近器件引脚。
  • 布局走线:电荷泵开关节点走线应尽可能短且宽,以降低寄生阻抗与干扰。
  • 散热与负载裕量:在高温或接近最大输出时留有裕量,避免长期满载工作以延长寿命。
  • 启动与保护:利用软启动与短路保护特性,可简化上级保护电路设计,但仍建议在关键应用中添加外部保护与监测。

六、封装与可靠性

器件采用业内超小尺寸封装(μMAX / MSOP-10),适合空间受限的板级设计。工作温度范围-40℃至+85℃,满足多数商业与工业等级应用的可靠性要求。结合内置保护与低功耗特性,MAX1759EUB+T是追求小型化、高效率、低待机功耗3.3V供电方案的理想选择。

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