Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ADI/LINEAR MAX998EUT+T MAX998EUT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ADI(Analog Devices) / LINEAR MAX998EUT+T
- Type
- ADI/LINEAR
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ADI(Analog Devices) / LINEAR
- Electronic Component
- MAX998EUT+T
- Electronic Component
- 1
- Package
- SOT-23-6
- Electronic Component
- Comparator
- Electronic Component
- 0.043g
- Power Supply
- 2.7V~5.5V
- Electronic Component
- 1
- Electronic Component
- Output
- Features
- Built-in
- Electronic Component
- BM0264526763
- Operating Temperature
- 40℃~+85℃
- Comparator
- Electronic Component
- Output
- CMOS；TTL
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MAX998EUT+T 模拟比较器产品概述
一、核心身份与基础定位
MAX998EUT+T是亚德诺半导体（ADI）旗下LINEAR系列的单路高速轨至轨模拟比较器，专为低电压、低功耗、抗干扰的快速比较场景设计。产品采用超小型SOT-23-6封装，兼顾性能与空间效率，可广泛适配工业控制、便携式设备等多领域应用。
二、关键性能参数解析
（一）输入特性：精度与抗干扰并重
输入端参数直接决定比较器的信号适配性与精度，核心表现如下：
- 输入失调电压（Vos）：2mV，输入信号接近阈值时仍能保证准确比较，减少阈值判断误差；
- 输入偏置电流（Ib）：75nA，低偏置电流降低信号源负载，适合高阻抗传感器或微弱信号输入；
- 输入失调电流（Ios）：5nA，偏置电流差异小，进一步提升比较精度；
- 共模抑制比（CMRR）：95dB，有效抑制共模噪声干扰，工业复杂电磁环境下仍稳定输出。
（二）输出特性：灵活兼容多系统
输出端设计兼顾易用性与兼容性：
- 推挽输出结构：无需外部上拉/下拉电阻，简化电路设计，降低BOM成本；
- 逻辑电平兼容：同时支持CMOS与TTL逻辑电平，直接对接不同数字电路，无需电平转换；
- 轨至轨输出：输出电平接近电源轨，最大利用电源动态范围，适配3.3V等低电压系统。
（三）动态与静态性能：平衡速度与功耗
- 传播延迟（tpd）：28ns（典型值），快速响应输入信号变化，满足高速脉冲、电平切换需求；
- 静态电流（Iq）：650uA，低功耗设计适配电池供电的便携式设备，延长续航时间。
（四）电源与温度范围：宽适配性
- 电源供电：支持2.7V~5.5V单电源，覆盖3.3V、5V常见系统，无需双电源；
- 工作温度：-40℃~+85℃，符合工业级标准，户外、车间等恶劣环境下稳定运行。
三、典型应用场景
结合性能特点，核心应用场景包括：
- 高速信号比较：PWM脉冲占空比监测、高速电平转换、快速信号识别；
- 低功耗便携式设备：智能手环、手持测试仪的低电压信号阈值判断；
- 工业控制：传感器（温度、压力）信号阈值检测、电机状态监测、报警触发；
- 通信辅助电路：串口/SPI信号电平判断、简单协议解析辅助。
四、产品核心优势
MAX998EUT+T的竞争力在于性能与实用性的平衡：
- 高速响应：28ns传播延迟满足快速比较需求；
- 低功耗：650uA静态电流适配便携与低功耗系统；
- 灵活兼容：轨到轨输出+CMOS/TTL兼容，降低系统设计复杂度；
- 抗干扰强：95dB CMRR抑制共模噪声，提升精度；
- 紧凑封装：SOT-23-6小封装节省PCB空间，适合高密度设计；
- 宽温宽压：-40+85℃工业温区+2.75.5V单电源，覆盖更多场景。
该产品以高性价比、多场景适配性，成为工业控制、便携式设备等领域的优选模拟比较器方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
