WMSIC Electronic Components

ADI/LINEAR MAX14575AETA+T MAX14575AETA

ModelMAX14575AETA+T
PackageTDFN-8-EP(2x2)
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR MAX14575AETA+T
Type
ADI/LINEAR
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
MAX14575AETA+T
Electronic Component
1
Package
TDFN-8-EP(2x2)
Electronic Component
Power Electronic Switch
Electronic Component
0.043g
Electronic Component
1
Features
Current
Electronic Component
BM0264921544
Resistor
32mΩ
Operating Temperature
40℃~+85℃
Operating Voltage
2.3V~5.5V
Current
2.5A
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX14575AETA+T 产品概述

MAX14575AETA+T 是 Analog Devices / Linear Technology 系列的一款高性能电源负载开关器件,面向要求低导通电阻、精确电流限制与多重保护功能的电源管理场合。该器件在 2.3V 至 5.5V 工作电压范围内工作,提供高达 2.5A 的最大连续电流能力,具有短路保护、过流保护、反向电流阻断与过温保护等完整的保护机制,封装为紧凑的 TDFN-8-EP (2 mm x 2 mm)。

一、核心参数与功能亮点

  • 工作电压:2.3 V ~ 5.5 V,适配 3.3V 与 5V 常见电源轨
  • 最大连续输出电流:2.5 A(峰值和持续能力需参考实际散热条件)
  • 导通电阻:典型 32 mΩ,低压降,降低功耗与发热
  • 可调电流限制:250 mA 至 2.5 A,可用于限制浪涌电流与保护下游负载
  • 控制逻辑:高电平有效(Enable 引脚为高电平时导通)
  • 保护特性:短路保护、过流保护、反向电流阻断、过温保护(热关断)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:TDFN-8-EP (2 x 2 mm),带外露散热焊盘以增强热性能

二、性能解读与设计意义

  1. 低导通电阻带来的系统优势
    32 mΩ 的低 RDS(on) 在高电流工作时能显著降低 I^2R 损耗与输出电压降。例如在 2.5 A 工况下,理论电压降约为 0.08 V,功耗约为 0.20 W(P = I^2·R)。较低的功耗意味着更小的器件结升温,有利于在紧凑系统中维持稳定热性能。

  2. 可调电流限制的作用
    可在 250 mA 至 2.5 A 范围内设定电流阈值,便于对不同负载进行入rush(浪涌)控制、过载保护和稳态电流限制。该特性在电源开机瞬态、电池接入或负载切换时尤为重要,可降低系统误动作与保险器件需求。

  3. 多重保护机制
    器件集成短路/过流检测与限制、反向电流阻断(在关断状态下阻止电源从输出回流至输入)以及热关断等功能,简化外部保护电路设计,提高系统可靠性。对于需要热插拔或对负载具有潜在短路风险的应用来说尤其合适。

三、典型应用场景

  • 移动与便携设备的电源路径管理(电池到系统或外设电源切换)
  • USB/OTG 电源保护与端口电源开关(支持 5 V 总线)
  • 工业与物联网终端的电源分配与负载隔离
  • 基于 PMIC 的子系统供电、模块热插拔保护
  • 任何要求可调限流、低压降与自动保护的电源负载开关场合

四、封装与热设计要点

  • 封装类型:TDFN-8-EP (2×2 mm),中央外露焊盘用于有效导热与机械固定。
  • PCB 布局建议:
    • 在外露焊盘下方和周围铺设足够的热量散布铜箔(多层 PCB 时连接到内层散热平面),以降低结-壳与结-环境温升。
    • 输入/输出电容尽量靠近相应引脚布置,缩短回流路径以稳定瞬态响应。
    • 宽短的电源走线能减小串联电阻并提升热散能力。
  • 注意事项:在接近最大连续电流运行时,应根据实际 PCB 散热条件计算器件结温,确保不触发热关断或超出器件热极限。

五、选型与使用建议

  • 在选用电流设定(或限流方式)时,考虑启动时的入rush 电流与负载特性,适当留有裕度以避免误动作。
  • 若系统需长期在接近 2.5 A 工作,必须验证 PCB 和外壳的散热能力,并参考器件完整的电气与热规范(datasheet)来评估安全余量。
  • 充分利用器件内建保护以取代部分外置保护器件,但对于极端短路或异常环境,仍建议配合熔断器或外部限流元件作为冗余保护。
  • 仔细查看制造商应用笔记和参考设计,采用推荐的寄生抑制与旁路电容,以保证稳定与 EMC 性能。

MAX14575AETA+T 以其低导通电阻、宽工作电压区间与完善的保护机制,适合对效率、可靠性与安全性要求较高的电源管理场合。欲获得完整电气特性曲线、引脚说明和建议布局,请参照 Analog Devices / Linear 的官方数据手册与应用笔记。

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