Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ADI/LINEAR MAX1487ESA+T MAX1487ESA
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ADI(Analog Devices) / LINEAR MAX1487ESA+T
- Type
- ADI/LINEAR
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ADI(Analog Devices) / LINEAR
- Electronic Component
- MAX1487ESA+T
- Electronic Component
- 1
- Package
- SOP-8
- Type
- Transceiver
- Electronic Component
- RS-485 / RS-422IC
- Electronic Component
- 0.219g
- Electronic Component
- 128
- Electronic Component
- 1
- Features
- Tx / Rx
- Electronic Component
- BM0258839467
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 4.75V~5.25V
- Receiver
- 1
- Data
- 2.5Mbps
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MAX1487ESA+T 产品概述
一、概述
MAX1487ESA+T 是一款单驱动器/单接收器（1/1）的差分收发器，支持 RS-422 与 RS-485 标准的半双工通信，工作电压为 4.75V ～ 5.25V，适用于工业级现场总线和长距离差分通信场合。器件针对低功耗与高抗扰性进行了优化，典型静态电流为 230 μA，工作温度范围 -40℃ ～ +85℃，并具有 ±15 kV 的静电防护能力，满足严苛环境下的可靠通信需求。
二、主要规格与特性
- 类型：半双工收发器（1 驱动 / 1 接收）
- 兼容标准：RS-422 / RS-485
- 供电电压：4.75 V ～ 5.25 V
- 最高数据速率：2.5 Mbps
- 总线节点数：最多 128 节点（具体受拓扑与终端匹配影响）
- 静态电流（静态或空闲）：230 μA
- 工作温度：-40℃ ～ +85℃
- ESD 抗扰性：±15 kV（人体模型/典型 IEC 测试）
- 封装：8 引脚 SOP（8-SOIC / SOP-8）
三、功能与应用场景
MAX1487ESA+T 适合用于需长距离、高抗扰能力的串行差分链路，例如工业自动化、楼宇控制、数据采集、PLC 互联、安防与仪表等。在半双工 RS-485 总线中常作为主/从节点的通信接口，适配多节点网络，支持较高的位速率（最高 2.5 Mbps），在短包或周期性数据传输中能满足大多数实时性要求。
四、设计要点与建议
- 终端匹配：长总线建议在两端各并接一个终端电阻（典型 120 Ω），以抑制反射；若网络中有分支或不对称拓扑，应根据波特率和线长优化终端与偏置网络。
- 偏置与故障保护：为保证空载或断线情况下的确定性，建议在总线上设置失效安全（fail-safe）偏置电阻，或使用集成偏置特性的收发器。
- 布线与接地：差分对成对屏蔽，尽量远离高频噪声源；单点接地或按系统接地规范处理，以降低共模干扰。
- ESD 与浪涌防护：器件本身具 ±15 kV ESD 抗扰，但在户外或强干扰场合仍建议在接口处加 TVS 二极管或浪涌抑制元件。
- 功耗与热管理：静态电流低，适合节能系统；在高工作占空比或高频率下注意评估功耗与封装散热条件。
五、封装与选型提示
MAX1487ESA+T 提供 SOP-8（8-SOIC）封装，便于通用的 PCB 布局和波峰回流或回流焊接。选型时应确认系统供电为稳压 5 V 范围（4.75–5.25 V），并核对总线最大节点数、所需数据速率及工作温度范围是否满足应用。若需更高集成度或差分通道数，可考虑多通道或带隔离的 RS-485/RS-422 器件。
总结：MAX1487ESA+T 以其低静态电流、工业级温度范围和良好的抗静电能力，适合在工业现场、楼宇与仪表类差分通信系统中作为可靠的 1/1 RS-422/RS-485 半双工收发器。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
