WMSIC Electronic Components

ADI/LINEAR LT3580EMS8E#TRPBF LT3580EMS8E

ModelLT3580EMS8E#TRPBF
PackageMSOP-8-EP
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR LT3580EMS8E#TRPBF
Type
ADI/LINEAR
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
LT3580EMS8E#TRPBF
Electronic Component
1
Package
MSOP-8-EP
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.055g
Electronic Component
1
Features
Frequency Synchronous
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0258741973
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
2.5V~32V
Switching Frequency
2MHz
Electronic Component
SEPIC

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LT3580EMS8E#TRPBF 产品概述

一款由 ADI(亚德诺/LINEAR)推出的高频率、低静态电流的升压型可调 DC-DC 控制芯片——LT3580EMS8E#TRPBF,封装为 MSOP-8-EP。器件集成了高压开关管,支持升压(Boost)、SEPIC 及反相(Inverting)三种拓扑,适用于对体积、效率与输出电压范围有较高要求的便携与工业电源设计。

一、主要技术参数

  • 功能类型:升压型(Boost),同时支持 SEPIC 与反相拓扑
  • 输入电压范围:2.5V ~ 32V
  • 输出电压范围:可调 5V ~ 42V
  • 最大输出电流:2A(受开关管、电感与热条件限制)
  • 开关频率:典型 2MHz(高频率有利于减小外部被动元件体积)
  • 静态电流(Iq):约 1mA,适合低功耗待机场景
  • 内置开关管:是(无需外置功率 MOSFET)
  • 同步整流:否(需外置肖特基二极管做续流)
  • 工作温度范围:-40℃ ~ +125℃(结温 TJ)
  • 输出通道数:单通道
  • 封装:MSOP-8-EP(带裸露散热 Pad)

二、主要特性与优势

  • 高集成度:内部功率开关减少外部器件数量,缩短设计周期。
  • 高频工作(2MHz):允许使用更小的电感与电容,方便实现小型化电源板。
  • 宽输入/输出范围:输入自 2.5V 可直接驱动低压电池系统,输出可调 5V~42V,适配多种负载需求。
  • 低静态电流:Iq ≈1mA,适合对空载与待机功耗敏感的便携应用。
  • 多拓扑支持:通过外接被动元件配置可实现升压、SEPIC 与负电压生成(反相),提高设计灵活性。

三、典型应用场景

  • 便携式仪器与手持设备(单节或多节电池升压)
  • 工业控制与传感器供电(需要宽输入、稳压输出)
  • 汽车电子(12V/24V 总线升压至控制/驱动电压,需考虑输入抖动与瞬态)
  • 背光驱动、传感器偏置或需要中高压的模拟电路供电(例如 12V→30V 等)

四、设计要点与建议

  • 续流二极管:因非同步整流结构,必须选用低正向压降且快速恢复的肖特基二极管,以降低整流损耗并提升效率。
  • 输入/输出电容:优先选用低 ESR 的陶瓷电容(MLCC),并在芯片 VIN 与 GND 端尽量靠近布置以抑制开关噪声。输出电容容量与耐压需按输出电压与纹波要求选择。
  • 电感选择:依据输出电流、纹波与效率目标选型,2MHz 工作频率允许较小电感体积,但需留意电流饱和和散热特性。
  • SEPIC/反相实现:SEPIC 需额外耦合/隔离电容与可能的第二电感(或耦合电感);反相拓扑则需配置相应的能量传输元件与极性处理电路。
  • EMI 与滤波:高频开关带来辐射与传导 EMI,应在输入端、输出端加合适滤波与共模/差模电感,尽量缩短高 di/dt 回路。
  • 热设计:MSOP-8-EP 的裸露散热 Pad 对热性能至关重要,请在 PCB 底层做足铜量与热 vias,以降低结温,提高输出能力与可靠性。

五、封装与可靠性注意

LT3580EMS8E#TRPBF 的 MSOP-8-EP 提供了小尺寸封装同时带裸露散热垫(EP),利于散热管理与批量焊接工艺。工作结温范围为 -40℃ 到 +125℃,实际应用中应保证在最大输出与环境条件下器件不超过寄结温度,必要时加大散热或限制输出功率。

六、典型外部元件参考(设计提示)

  • 续流二极管:低 VF 肖特基(耐压根据最高输出电压选择)
  • 输入电容:多层陶瓷 MLB(低 ESR)并配合旁路电容
  • 输出电容:陶瓷为主,必要时并联电解/钽电容以提升滤波能量
  • 电感:根据电流等级选用低直流电阻、低饱和的功率电感或耦合电感(SEPIC)
  • 布局:将 SW、D、输出电容构成的高频回路面积最小化,VIN 与 GND 的旁路靠近芯片引脚

结语:LT3580EMS8E#TRPBF 以其高开关频率、宽输入输出范围与多拓扑支持,适合需要小型化与多样输出方案的设计。合理的元件选型与 PCB 热/EMI 布局是获得高效率、稳定输出和可靠性的关键。若需将该器件用于特定电流/温度/效率目标,建议参考官方 Datasheet 的典型应用电路与元件计算指南进行仿真与样机验证。

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