Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MAX31790ATI+T(ADI/Linear)是一款集成FET的电源/驱动类器件,主要参数如下:工作电压范围 3.0V ~ 5.5V;带集成功率开关(Integrated FET);通过 I2C 总线进行配置与控制;静态电流 (Iq) 典型约 3mA;工作温度范围 -40℃ ~ +125℃;封装为 TQFN-28-EP(4×4mm)。本器件并非内置 H 桥(H-bridge 数量:0),适于作为点位开关或预驱动器使用。
该器件定位为可通过数字总线精细控制的功率开关/驱动单元。集成 FET 降低外部器件数量与 PCB 面积,I2C 接口便于在系统中通过寄存器配置开关状态、输出模式及定时/保护参数(具体寄存器与功能以器件数据手册为准)。由于不包含 H 桥,若需双向驱动或全桥驱动,则需外接互补 FET 或采用外部 H 桥方案协同工作。
TQFN-28-EP(4×4mm)带底部散热金属垫(EP),建议在 PCB 设计时配合多层散热过孔与大铜箔热盲区,以保证功率损耗时的热传导。输入输出路径应尽量短且宽,关键旁路电容靠近电源引脚布局。由于器件工作电压上限为 5.5V,设计时应考虑浪涌与反向瞬态抑制。
该器件优势在于:低静态功耗(Iq≈3mA)、宽工作电压与工业级温度覆盖、集成 FET 简化 BOM 与板级布局。注意其并非内置 H 桥,功能与保护细节应以官方数据手册为准,开发前需获取完整数据资料与评估样片测试结果。
如需我帮您整理该型号的数据手册要点、引脚定义或典型应用参考电路,我可以继续提供。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products