WMSIC Electronic Components

ADI/LINEAR MAX407CSA+T MAX407CSA

ModelMAX407CSA+T
PackageSO-8
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR MAX407CSA+T
Type
ADI/LINEAR
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
MAX407CSA+T
Electronic Component
1
Package
SO-8
Electronic Component
Operational Amplifier
Electronic Component
0.13g
Electronic Component
1
Electronic Component
Output
Electronic Component
BM0262662676
Operating Temperature
0℃~+70℃
Amplifier
2
Output Current
600uA
(SR)
5V/ms
Power Supply Voltage
2.5V~10V
Static Current(Iq)
1.2uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX407CSA+T 产品概述

一、概述

MAX407CSA+T 是来自 ADI(亚德诺)/LINEAR 系列的双路低功耗轨到轨输出运算放大器,针对单电源系统优化。器件在2.5V~10V 单电源下可靠工作,最大电源差为10V,适合电池供电与便携式测量设备。器件静态电流极低,输入偏置小,适合对直流精度和低噪声有要求的传感器前端与数据采集电路。

二、主要性能参数

  • 放大器数:双路
  • 工作电源:单电源 2.5V ~ 10V(Vdd-Vss ≤ 10V)
  • 输出类型:轨到轨输出(Rail-to-Rail)
  • 增益带宽积(GBP):8 kHz
  • 输入失调电压(Vos):3 mV;温漂(Vos TC):10 μV/℃
  • 压摆率(SR):5 V/ms
  • 输入偏置电流(Ib):10 pA
  • 噪声密度(eN):150 nV/√Hz @ 1 kHz
  • 共模抑制比(CMRR):80 dB
  • 静态电流(Iq):1.2 μA(每通道)
  • 输出电流:600 μA
  • 工作温度范围:0 ℃ ~ +70 ℃
  • 封装:SO‑8

以上参数表明 MAX407CSA+T 在低功耗、低偏置电流与中低频精度应用上表现突出,但其 GBP 较小,适合直流到低频信号处理,而非高速信号链。

三、典型应用场景

  • 传感器信号调理与放大(温度、压力、电化学传感器等)
  • 低功耗数据采集前端、滤波器与缓冲器
  • 电池供电便携仪表与便携医疗设备(需注意温度范围)
  • 精密比较、参考缓冲与直流耦合放大器

四、设计与使用建议

  • 电源旁路:尽管静态电流低,建议在电源引脚近端加 0.1 μF 陶瓷旁路;在噪声敏感电路中可并联更大容量电容以降低电源干扰。
  • 输入保护:轨到轨输出并不等同于输入允许无限大共模范围,设计时应保证输入不超过电源范围并考虑保护二极管或限流。
  • 负载能力:输出峰值电流约 600 μA,适合高阻抗负载或驱动后级高输入阻抗电路,不适合驱动大电流负载。
  • 温漂与偏置:Vos 3 mV 且温漂较小,适用于需要长期稳定基线的测量;若需更高精度可采用后端校准或配合差分测量。

五、封装与采购信息

  • 型号:MAX407CSA+T
  • 品牌:ADI(亚德诺)/LINEAR
  • 封装形式:SO‑8,适合自动贴片生产与常规 PCB 布局。

总结:MAX407CSA+T 是一款面向低功耗、低频精度应用的双路轨到轨运放,兼顾低偏置与低噪声特性,非常适合便携式传感与数据采集前端设计。在使用时注意其带宽与输出驱动能力的限制,并按建议做好电源与输入保护设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.